Soc System On Chip AGIB022R29A2I1VB product image

AGIB022R29A2I1VB

$36,919.93
  • Description:IC FPGA AGILEX-I 2957BGA
  • Series:Agilex I

SKU:21b6170e60bc Category: Brand:

  
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AGIB022R29A2I1VB is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-I 2957BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGIB022R29A2I1VB

  • Description:IC FPGA AGILEX-I 2957BGA
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.2M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:2957-BFBGA Exposed Pad
  • Supplier Device Package:2957-BGA (56x45)

Soc System On Chip datasheet and documents for AGIB022R29A2I1VB

AGIB022R29A2I1VB

Soc System On Chip Overview

The Altera AGIB022R29A2I1VB is a System on Chip (SoC) Field Programmable Gate Array belonging to the Agilex I series. It integrates an FPGA fabric with 2.2 million logic elements and a quad-core ARM Cortex-A53 processor running at 1.4 GHz. The device features 256 KB of RAM, 720 I/Os, and supports interfaces including Ethernet, USB OTG, SPI, and UART. It operates within a temperature range of -40°C to 100°C TJ and utilizes a 3184-BGA package measuring 56x45 mm.

Soc System On Chip Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology for embedded control
  • Provides high-density programmability through 2.2 million FPGA logic elements
  • Supports diverse connectivity via integrated peripherals such as Ethernet, USB OTG, and MMC/SD/SDIO

Soc System On Chip Applications

  • Industrial automation controllers requiring deterministic processing
  • Telecommunications infrastructure equipment
  • Automotive infotainment and instrument clusters

Soc System On Chip Procurement Notes

Verify the specific suffix 'I1' against official datasheets to confirm the industrial temperature grade (-40°C to 100°C). Ensure compatibility with the 3184-BGA footprint during board design. Confirm moisture sensitivity levels and handling guidelines prior to assembly.

Soc System On Chip Selection Notes

Select this model when both high-performance ARM processing and substantial FPGA resources are required in a single component. Compare against the E1 variant if commercial temperature ranges suffice. Evaluate power consumption profiles against system thermal constraints given the 1.4 GHz processor speed.

Soc System On Chip Part Context

This component is part of the Agilex I family, designed for mid-range SoC applications. It shares architectural similarities with other Agilex devices but offers specific logic density and package configurations tailored for space-constrained designs requiring robust embedded processing capabilities.

Soc System On Chip Replacement Considerations

Direct substitutes include the AGIB022R31A2I1VB and AGIB022R31A2E1VB, which share the same package and core architecture but offer different logic densities or temperature grades. Verify pinout compatibility before substitution.

AGIB022R29A2I1VBAGIB022R29A2I1VB
$36,919.93
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