Soc System On Chip AGIB022R29A2I3V product image

AGIB022R29A2I3V

$27,689.60
  • Description:IC FPGA AGILEX-I 2957BGA
  • Series:Agilex I

SKU:9762fa0a4006 Category: Brand:

  
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AGIB022R29A2I3V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-I 2957BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGIB022R29A2I3V

  • Description:IC FPGA AGILEX-I 2957BGA
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.2M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:2957-BFBGA Exposed Pad
  • Supplier Device Package:2957-BGA (56x45)

Soc System On Chip datasheet and documents for AGIB022R29A2I3V

AGIB022R29A2I3V

Soc System On Chip Overview

The Altera AGIB022R29A2I3V is an Agilex I System on Chip (SoC) Field Programmable Gate Array. It integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point units, alongside 2.2 million logic elements. The device operates at speeds up to 1.4 GHz and includes 256 KB of RAM. It features 720 I/Os and supports interfaces including Ethernet, USB OTG, SPI, and UART. The component is housed in a 2957-IBGA package and functions within a junction temperature range of -40°C to 100°C.

Soc System On Chip Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology for embedded control tasks.
  • Provides 2.2 million logic elements for high-density programmable logic implementation.
  • Supports diverse connectivity protocols including Ethernet, MMC/SD/SDIO, and USB OTG.

Soc System On Chip Applications

  • Industrial automation controllers requiring deterministic processing.
  • Telecommunications infrastructure equipment.
  • Embedded systems demanding combined CPU and FPGA capabilities.

Soc System On Chip Procurement Notes

Verify the specific suffix 'I3V' against official manufacturer documentation to confirm operating temperature and package variations. Ensure compatibility with Agilex I design tools. Confirm moisture sensitivity level handling requirements prior to assembly. Validate that the 2957-IBGA footprint matches the target board layout specifications.

Soc System On Chip Selection Notes

Select this model when a balance of moderate logic density and embedded processing is required. Compare against the AGIB022R31 series if higher I/O counts or different packaging options are needed. Consider the 1.4 GHz maximum frequency for timing closure feasibility. Evaluate thermal management needs for the BGA package under load.

Soc System On Chip Part Context

This part belongs to the Agilex I family, designed for mid-range applications. It shares architectural similarities with other Agilex SoCs but offers distinct logic capacity and pinout configurations. The series emphasizes integration of hard processor systems with programmable fabric.

Soc System On Chip FAQ

What is the logic element count for this device?

The AGIB022R29A2I3V contains 2.2 million logic elements.

Does this SoC include an integrated processor?

Yes, it integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point support.

What is the maximum operating junction temperature?

The maximum operating junction temperature is 100°C.

AGIB022R29A2I3VAGIB022R29A2I3V
$27,689.60
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