AGIB022R31B1I1V

Soc System On Chip Overview

The AGIB022R31B1I1V is an Agilex I Series System-on-Chip integrating a 2.2M logic element FPGA fabric with a quad-core ARM Cortex-A53 processor running at 1.4GHz. It features 256KB of embedded RAM and supports up to 720 user I/Os. The device utilizes a 3184-ball BGA package measuring 56x45mm. It includes CoreSight debug infrastructure, ARM NEON SIMD, and hardware floating-point units. Peripheral interfaces encompass Ethernet, USB OTG, SPI, UART, I2C, MMC/SD/SDIO, and EBI/EMI memory controllers.

Soc System On Chip Feature Summary

• Integrates a high-density FPGA fabric with a multi-core ARM application processor for heterogeneous computing.
• Includes comprehensive CoreSight debugging and tracing capabilities for software development.
• Supports diverse connectivity standards including high-speed serial interfaces and standard peripheral buses.
• Features dedicated hardware acceleration engines such as ARM NEON and floating-point units.

Soc System On Chip Applications

• Industrial automation and control systems requiring real-time processing.
• Telecommunications infrastructure equipment utilizing high-speed data interfaces.
• Medical imaging devices needing combined signal processing and control logic.
• Automotive infotainment and advanced driver-assistance system prototypes.

Soc System On Chip Procurement Notes

Verify the specific suffix characters in the part number to confirm the operating temperature range and package variant. The 'B' designation typically indicates a specific speed grade or bin within the Agilex I family. Confirm compatibility with existing board layouts due to the 3184-BGA footprint dimensions. Ensure supply chain sources provide official documentation matching the exact alphanumeric sequence.

Soc System On Chip Selection Notes

Select this component when a balance of programmable logic capacity and hard processor system performance is required. Compare against other Agilex I variants based on specific logic element counts and available I/O banks. Consider thermal management requirements for the 1.4GHz processor operation. Evaluate pinout compatibility if replacing previous generation Intel FPGA SoCs.

Soc System On Chip Part Context

This part belongs to the Agilex I series, designed for cost-sensitive applications compared to the higher-performance Agilex F series. It shares the same architectural foundation but targets mid-range market segments. The device leverages Intel's 10nm SuperFin technology for improved power efficiency. It serves as a bridge between traditional microcontrollers and high-end FPGA solutions.

Soc System On Chip Replacement Considerations

Direct substitutes include other Agilex I parts with identical package and core configurations but different speed grades or temperature ranges. Cross-family migration to Agilex F requires significant redesign. Verify pin-to-pin compatibility before considering alternative vendors, as no direct cross-brand equivalents exist.