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AGIB022R31B3E3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-I 3184FBGA. Review the specifications below when checking this part for your BOM.
The Altera AGIB022R31B3E3E is an Agilex I Series System on Chip (SoC) integrating a programmable FPGA fabric with a hard processor system. It features 2.2 million logic elements and a quad-core ARM Cortex-A53 MPCore processor running at 1.4 GHz, equipped with CoreSight debug infrastructure, ARM NEON, and floating-point units. The device includes 256KB of RAM and supports 720 I/Os via a 3184-ball FBGA package. Operating temperature range is 0°C to 100°C TJ. Connectivity options include Ethernet, USB OTG, SPI, UART, I2C, MMC/SD/SDIO, and EBI/EMI interfaces.
Verify the specific suffix 'E3E' against official datasheets to confirm the commercial temperature grade and package variant. Ensure compatibility with Agilex I series design tools and check for any recent Product Change Notifications regarding labeling or material composition updates before finalizing procurement orders.
Select this model when a balance of moderate logic density and embedded processing power is required. The Agilex I series targets cost-sensitive edge applications compared to higher-tier families. Confirm that the 2.2M logic element count meets design requirements without excessive overhead, and verify that the 1.4GHz processor speed aligns with software execution needs.
This component belongs to the Agilex I family, designed for entry-level to mid-range SoC applications within the broader Agilex portfolio. It shares architectural similarities with Agilex 7 devices but offers optimized resource allocation for specific market segments. The part utilizes the same Hard Processor System architecture found in larger Agilex variants.
Direct substitutes within the Agilex I series include AGIB022R31B3I3E for industrial temperature ratings. Cross-family migration to Agilex 7 requires re-evaluation of pinouts and resource utilization. Verify pin compatibility and thermal specifications when considering alternative packages.
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