AGIB023R18A1E1V

Soc System On Chip Overview

The AGIB023R18A1E1V is an Agilex I System on Chip (SoC) Field Programmable Gate Array manufactured by Altera. It integrates a hard processor system featuring a quad-core ARM Cortex-A53 MPCore with CoreSight, ARM NEON, and floating-point capabilities. The device contains 2.3 million logic elements and operates at a maximum speed of 1.4 GHz. It includes 256 KB of RAM and provides 480 input/output pins. The component is housed in a 1805-BGA package measuring 42.5 x 42.5 mm with bare pads. It supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces, functioning within a junction temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology for embedded processing tasks.
• Provides 2.3 million logic elements for complex programmable logic applications.
• Supports high-speed serial connectivity through integrated Ethernet and USB OTG interfaces.

Soc System On Chip Applications

• High-performance embedded systems requiring combined FPGA and processor capabilities
• Industrial automation controllers utilizing ARM Cortex-A53 processing cores
• Communication infrastructure equipment leveraging integrated Ethernet and high-speed I/O

Soc System On Chip Procurement Notes

Verify the specific suffix 'E1' against official Altera documentation to confirm pinout and electrical characteristics, as suffix variations often denote distinct manufacturing revisions or material compositions. Confirm that the 1805-BGA package dimensions match the target PCB footprint requirements precisely. Ensure compatibility with the required operating temperature range of 0°C to 100°C TJ for the intended deployment environment before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this model when a design requires exactly 2.3 million logic elements combined with a quad-core ARM Cortex-A53 processor. Compare against the AGIB023R18A1E2VB variant if different interface configurations or manufacturing revisions are required. Verify that the 1805-BGA package size of 42.5 x 42.5 mm fits within the mechanical constraints of the enclosure. Ensure the 1.4 GHz operating speed meets the real-time processing demands of the application architecture.

Soc System On Chip Part Context

This component belongs to the Agilex I series, which bridges traditional FPGA flexibility with embedded processor performance. It shares architectural similarities with other Agilex devices but is distinguished by its specific 2.3M LE density and ARM Cortex-A53 integration. The part utilizes the 1805-BGA package format common to higher-density Agilex SoCs, facilitating reuse of board designs across related product families within the Agilex portfolio.

Soc System On Chip Replacement Considerations

The AGIB023R18A1E2V is listed as a manufacturer-recommended alternative. Verify functional equivalence regarding the ARM core configuration and logic density before substitution. Other Agilex I variants may require significant schematic and layout modifications due to differing pin counts or package sizes.