Soc System On Chip AGIB023R18A2I1V product image

AGIB023R18A2I1V

$28,917.91
  • Description:IC FPGA AGILEX-I 1805FBGA
  • Series:Agilex I

SKU:39d8ebeab564 Category: Brand:

  
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AGIB023R18A2I1V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-I 1805FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGIB023R18A2I1V

  • Description:IC FPGA AGILEX-I 1805FBGA
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1805-BBGA Exposed Pad
  • Supplier Device Package:1805-BGA (42.5x42.5)

Soc System On Chip datasheet and documents for AGIB023R18A2I1V

AGIB023R18A2I1V

Soc System On Chip Overview

The AGIB023R18A2I1V is an Agilex I Series System on Chip (SoC) integrating a Field Programmable Gate Array with a quad-core ARM Cortex-A53 processor. It features 2.3 million logic elements and operates at speeds up to 1.4 GHz. The device utilizes a 1805-ball BGA package measuring 42.5 x 42.5 mm. Key specifications include 480 user I/Os, 256 KB of embedded RAM, and support for peripherals such as DMA and WDT. Connectivity options encompass Ethernet, USB OTG, SPI, UART, I2C, and MMC/SD/SDIO interfaces.

Soc System On Chip Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug capabilities and floating-point units.
  • Provides high-density programmable logic with 2.3 million logic elements for complex digital design.
  • Supports diverse peripheral connectivity including Ethernet, USB OTG, and standard serial interfaces.
  • Features bare pad packaging for direct board attachment in surface-mount applications.

Soc System On Chip Applications

  • High-performance embedded computing systems requiring combined processing and programmability.
  • Industrial automation controllers utilizing integrated ARM cores and FPGA logic.
  • Communication infrastructure equipment leveraging Ethernet and serial interface capabilities.

Soc System On Chip Procurement Notes

Verify the specific suffix 'I1' against official Altera documentation to confirm temperature grade and speed bin accuracy. Ensure compatibility with Agilex I series development tools and verify that the 1805-BGA bare pad package requirements align with PCB manufacturing capabilities. Confirm moisture sensitivity level handling procedures prior to assembly.

Soc System On Chip Selection Notes

Select this model when 2.3M logic elements and quad-core ARM processing are required within a compact 1805-ball form factor. Compare against other Agilex I variants if higher I/O counts or different thermal profiles are needed. Ensure the design supports the specific voltage domains and transceiver requirements defined in the Agilex 7 data sheet.

Soc System On Chip Part Context

This component belongs to the Agilex I series, part of Intel's (formerly Altera) advanced FPGA portfolio. It shares architectural similarities with other Agilex devices but offers specific logic density and processor integration tailored for cost-sensitive yet high-performance SoC applications. The series emphasizes efficient power consumption alongside robust programmable logic capabilities.

Soc System On Chip Replacement Considerations

Direct substitutes within the same family include AGIB023R18A1E1VB and AGIB023R18A2E1VB, which share identical pinouts and core specifications but may differ in speed grades or industrial temperature ratings. Verify suffix differences carefully before substitution.

AGIB023R18A2I1VAGIB023R18A2I1V
$28,917.91
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