Soc System On Chip AGIB023R18A2I3E product image

AGIB023R18A2I3E

$25,303.74
  • Description:IC FPGA AGILEX-I 1805FBGA
  • Series:Agilex I

SKU:868f3d1f50e0 Category: Brand:

  
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AGIB023R18A2I3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-I 1805FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGIB023R18A2I3E

  • Description:IC FPGA AGILEX-I 1805FBGA
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1805-BBGA Exposed Pad
  • Supplier Device Package:1805-BGA (42.5x42.5)

Soc System On Chip datasheet and documents for AGIB023R18A2I3E

AGIB023R18A2I3E

Soc System On Chip Overview

The Altera AGIB023R18A2I3E is an Agilex I Series System on Chip (SoC) FPGA integrated circuit. It features a quad-core ARM Cortex-A53 MPCore processor with CoreSight, NEON, and floating-point capabilities running at 1.4GHz. The device includes 2.3 million logic elements and 256KB of RAM. It offers 480 I/Os and supports interfaces including Ethernet, USB OTG, SPI, UART, I2C, MMC/SD/SDIO, EBI/EMI, and DMA/WDT peripherals. Packaged in a 1805-BBGA bare pad format measuring 42.5x42.5mm, it operates within a junction temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with hardware acceleration for embedded control tasks alongside programmable fabric
  • Provides high-density logic resources suitable for complex digital signal processing and interface bridging applications
  • Supports multiple high-speed communication protocols including Ethernet and USB OTG for versatile connectivity

Soc System On Chip Applications

  • Industrial automation controllers requiring deterministic processing and flexible I/O
  • Network infrastructure equipment utilizing Ethernet connectivity and packet processing
  • Embedded systems integrating ARM software execution with custom hardware acceleration

Soc System On Chip Procurement Notes

Verify the specific suffix 'I3E' against official manufacturer documentation to confirm pinout, speed grade, and environmental ratings. Ensure compatibility with the Agilex I design tools and verify that the 1805-BBGA package requires appropriate board-level thermal management solutions for the specified operating temperature range.

Soc System On Chip Selection Notes

Select this component when a combined ARM processing core and substantial FPGA fabric are required in a single package. Compare the 2.3M logic element count and 1.4GHz processor speed against project requirements. Consider the 1805-ball BGA footprint constraints during PCB layout planning and ensure sufficient power delivery for the SoC architecture.

Soc System On Chip Part Context

This part belongs to the Agilex I series, designed for mid-range performance applications. It sits between lower-density Cyclone devices and higher-end Agilex 7 or Stratix families. The 'I' designation typically indicates industrial temperature grading within the Agilex portfolio structure.

Soc System On Chip Replacement Considerations

Consult official substitution guides for Agilex I family members. Verify if variants with different logic densities or processor configurations meet functional needs without redesigning the carrier board.

AGIB023R18A2I3EAGIB023R18A2I3E
$25,303.74
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