AGIB023R31B2I3V

Soc System On Chip Overview

The Altera AGIB023R31B2I3V is an Agilex I System on Chip (SoC) FPGA featuring a hard processor system with a quad-core ARM Cortex-A53 MPCore, CoreSight, and NEON. It integrates 2.3 million logic elements within a 3184-ball BGA package measuring 56x45 mm. The device operates at speeds up to 1.4 GHz with 480 I/Os and includes 256 KB of RAM. It supports interfaces including Ethernet, USB OTG, SPI, UART, I2C, MMC/SD/SDIO, and EBI/EMI. Operating temperature ranges from -40°C to 100°C TJ.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point capabilities for embedded control tasks.
• Provides high-density programmable logic resources suitable for complex digital signal processing and acceleration.
• Includes comprehensive connectivity peripherals such as Ethernet, USB OTG, and standard serial buses.

Soc System On Chip Applications

• Industrial automation controllers requiring real-time processing and field programmability.
• Telecommunications infrastructure equipment utilizing high-speed serial interfaces.
• Medical imaging systems needing combined data acquisition and processing capabilities.

Soc System On Chip Procurement Notes

Verify the specific suffix 'I3' against official datasheets to confirm industrial temperature range and package details. Confirm RoHS compliance status through manufacturer documentation prior to integration. Ensure PCB design accounts for the 3184-BGA footprint and moisture sensitivity level requirements during storage and handling.

Soc System On Chip Selection Notes

Compare this model against other Agilex I variants based on required logic element count and I/O availability. Evaluate power consumption profiles against available cooling solutions. Verify that the integrated memory size meets application constraints before selecting alternative SoC configurations.

Soc System On Chip Part Context

This component belongs to the Agilex I family, designed for mid-range applications balancing performance and cost. It shares architectural similarities with higher-density Agilex 7 devices but offers optimized resource allocation for specific embedded logic needs.

Soc System On Chip Replacement Considerations

Direct substitutes include other Agilex I models with similar logic densities such as AGIB023R31B2E3V, though pinout and thermal characteristics must be verified. Cross-family migration to Agilex 5 or 7 requires significant redesign due to architectural differences.