AGIB027R29A1I1VB

Soc System On Chip Overview

The Altera AGIB027R29A1I1VB is a System on Chip (SoC) integrated circuit belonging to the Agilex I FPGA series. It integrates a four-core ARM Cortex-A53 MPCore processor with CoreSight technology, ARM NEON, and floating-point capabilities alongside an FPGA fabric containing 2.7 million logic elements. The device operates at a maximum frequency of 1.4GHz and includes 256KB of RAM. It features 720 I/Os and supports interfaces including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The component is housed in a 2957-BGA package measuring 56x45 mm and functions within a junction temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with CoreSight for embedded control tasks
• Provides a high-density FPGA fabric with 2.7M logic elements for custom hardware acceleration
• Supports diverse peripheral connectivity including Ethernet, USB OTG, and standard serial protocols

Soc System On Chip Applications

• High-performance networking equipment requiring low-latency packet processing
• Industrial automation systems utilizing programmable logic for real-time control
• Embedded infrastructure platforms combining general-purpose computing with hardware customization

Soc System On Chip Procurement Notes

Verify the specific suffix 'I1' against official Intel/Altera documentation to confirm pinout and electrical characteristics, as variations exist within the Agilex I family. Confirm availability through authorized distributors, as lead times may vary. Ensure compliance with RoHS directives and check for any recent Product Change Notifications regarding labeling or packaging updates before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this model when a balance between embedded processing power and flexible logic resources is required. The 2.7M element count suits moderate complexity designs. Compare against other Agilex I variants if higher logic density or different package sizes are needed. Ensure the design utilizes the 2957-BGA footprint constraints and meets the thermal requirements for the specified operating temperature range.

Soc System On Chip Part Context

This component is part of the Agilex I series, designed for cost-sensitive applications compared to the F-Series. It shares architectural similarities with other Agilex devices but offers a specific logic density optimized for embedded SoC implementations. It serves as a bridge between traditional microprocessors and high-end FPGAs, enabling heterogeneous computing architectures in compact form factors.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and functionality include AGIB027R29A1E1VB and AGIB027R29A1E2V. Verify that the suffix change does not alter the speed grade or feature set. Cross-referencing with the Agilex 7 Device Data Sheet is recommended to ensure compatibility with existing board layouts and software drivers.