AGIB027R31A1I1V

Soc System On Chip Overview

The AGIB027R31A1I1V is an Agilex I Series System on Chip (SoC) integrating a hard processor system with FPGA fabric. It features a quad-core ARM Cortex-A53 MPCore processor running at 1.4GHz, equipped with CoreSight debug infrastructure and NEON SIMD capabilities. The device contains 2.7 million logic elements and provides 720 user I/Os within a 3184-ball FBGA package measuring 56x45 mm. Internal memory includes 256KB of RAM. It supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces, operating within a junction temperature range of -40°C to 100°C.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point units for high-performance computing tasks alongside programmable logic.
• Provides extensive connectivity through hardened peripherals including Ethernet, USB OTG, and multiple serial communication protocols.
• Features a large-scale FPGA fabric with 2.7M logic elements and 720 I/Os for complex digital design implementation.

Soc System On Chip Applications

• Industrial automation controllers requiring deterministic real-time processing
• Telecommunications infrastructure equipment utilizing hardened Ethernet interfaces
• Automotive infotainment systems leveraging the integrated ARM processor

Soc System On Chip Procurement Notes

Verify the specific suffix 'I1' against official Altera documentation to confirm the industrial temperature grade (-40°C to 100°C). Ensure compatibility with the 3184-ball BGA footprint during PCB layout. Confirm current availability status as distribution channels may list this part as made-to-order or out of stock.

Soc System On Chip Selection Notes

Select this model when an industrial-grade temperature rating is required for the Agilex I family. Compare against the 'E1' suffix variant if commercial temperature ranges suffice, noting that the 'I1' designation specifically denotes extended thermal performance. Verify that the 2.7M logic element density meets the design complexity requirements without unnecessary cost overhead.

Soc System On Chip Part Context

This component belongs to the Agilex I series, positioned between the Agilex 3 and Agilex 7 families in terms of density and feature set. It shares the same 3184-ball package form factor as other devices in the R31 sub-series, facilitating potential pin-compatible design strategies across different logic densities within the same package constraint.

Soc System On Chip Replacement Considerations

AGIB027R31A1E1V: Commercial temperature grade variant with identical electrical and logical specifications but limited to 0°C to 100°C operation.

Soc System On Chip FAQ

What is the maximum operating junction temperature for the AGIB027R31A1I1V?

The maximum operating junction temperature is 100°C, consistent with its industrial temperature grade classification.

Does this SoC include hardware debugging support?

Yes, the integrated ARM Cortex-A53 cores include CoreSight debug infrastructure for system-level debugging and trace analysis.

What is the physical package dimension for this part?

The device is housed in a 3184-ball FBGA package with dimensions of 56mm by 45mm.