SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
AGIB027R31B1E2V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-I 3184FBGA. Review the specifications below when checking this part for your BOM.
The AGIB027R31B1E2V is an Agilex I Series System on Chip FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug support, ARM NEON multimedia extensions, and floating-point units. The device features 2.7 million logic elements and operates at speeds up to 1.4GHz. It includes 256KB of RAM and provides 720 I/Os. Connectivity options include EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are supported. The component is housed in a 3184-BFBGA package with bare pads, measuring 56x45mm, and functions within a junction temperature range of 0°C to 100°C.
Verify the specific suffix 'E2' against official Altera documentation to confirm exact speed grade and packaging variations. Ensure compatibility with existing board layouts due to the 3184-BFBGA footprint dimensions. Confirm that the required operating temperature range aligns with system thermal design specifications before finalizing procurement orders.
Select this model when 2.7M logic elements and 1.4GHz performance are required within the Agilex I family. Compare against AGIB027R31A variants if different speed grades or package markings are needed. Verify that the 720 I/O count meets interface requirements for the target application design.
This component belongs to the Agilex I Series, designed for mid-range SoC FPGA applications. It shares architectural similarities with other Agilex I models like AGIB027R31A1E1V but differs in specific speed binning and manufacturing revisions. The series targets cost-sensitive designs requiring ARM processor integration alongside FPGA fabric.
AGIB027R31A1E1V
The processor cores operate at speeds up to 1.4GHz.
Yes, the integrated ARM Cortex-A53 MPCore includes floating-point unit support.
The device uses a 3184-BFBGA package with bare pads, sized 56x45mm.
Explore related parts through Embedded, Integrated Circuits (ICs), all product categories, ChipApex homepage.