AGIB027R31B2E2VB

Soc System On Chip Overview

The Altera AGIB027R31B2E2VB is an Agilex I Series System on Chip FPGA featuring a hard processor system with a quad-core ARM Cortex-A53 MPCore. It integrates 2.7 million logic elements and supports operation speeds up to 1.4 GHz. The device includes 256 KB of RAM and provides 720 I/Os within a 3184-ball BGA package measuring 56x45 mm. Operating temperatures range from 0°C to 100°C TJ.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point capabilities
• Provides 2.7 million logic elements for complex programmable logic applications
• Supports high-speed connectivity including Ethernet, USB OTG, and SPI interfaces

Soc System On Chip Applications

• High-performance embedded processing systems requiring FPGA flexibility
• Industrial automation controllers utilizing ARM Cortex-A53 cores
• Network infrastructure equipment leveraging integrated Ethernet and transceiver capabilities

Soc System On Chip Procurement Notes

Verify the specific suffix 'B2' against official datasheets to confirm speed grade and temperature ratings. Confirm package availability as distribution status varies. Ensure compatibility with Agilex I series design tools before ordering.

Soc System On Chip Selection Notes

Select this model for designs requiring 2.7M LE density combined with ARM processing power. Compare against AGFA variants if F-series features are preferred. Validate pinout compatibility with existing PCB layouts due to the 3184-BGA form factor.

Soc System On Chip Part Context

This component belongs to the Agilex I family, distinct from the Agilex F series. It targets cost-sensitive applications while maintaining high performance through the integration of hard processor systems and scalable logic resources within the same package footprint.

Soc System On Chip Replacement Considerations

AGIB027R31A2E2VB serves as a potential substitute within the same Agilex I family. Verify that the A-suffix meets the required speed grade and thermal specifications for the target application environment.