AGIB041R31B1E1VB

Soc System On Chip Overview

The Altera AGIB041R31B1E1VB is an Agilex I Series System on Chip (SoC) integrating a Field Programmable Gate Array with a Hard Processor System. It features four ARM Cortex-A53 cores operating at 1.4GHz, equipped with CoreSight debug infrastructure and NEON SIMD units. The FPGA fabric provides 4 million logic elements. The device includes 256KB of embedded RAM and supports up to 720 user I/Os. Connectivity interfaces include Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI. It is housed in a 2957-ball BGA package measuring 56x45 mm and operates within a junction temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with hardware floating-point support for efficient system control and data processing tasks.
• Provides a high-density FPGA fabric with 4 million logic elements for customizable digital logic implementation.
• Supports diverse peripheral connectivity through integrated hard IP blocks including Ethernet and USB OTG controllers.

Soc System On Chip Applications

• Industrial automation controllers requiring deterministic real-time processing
• Telecommunications infrastructure equipment utilizing high-speed serial interfaces
• Medical imaging systems demanding flexible signal processing architectures

Soc System On Chip Procurement Notes

Verify the specific suffix characters against official datasheets to confirm package type and temperature grade. Confirm that the ordering part number matches the required density and speed bin. Ensure compatibility with existing board layouts regarding the 2957-ball BGA footprint. Check for any recent Product Change Notifications affecting marking or labeling requirements before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this component when a balance of moderate FPGA capacity and robust ARM processing is required. Compare logic element counts against alternative Agilex I variants to ensure sufficient resources for design complexity. Verify that the 2957-ball package dimensions fit within the mechanical constraints of the target enclosure. Evaluate power consumption profiles against available thermal management solutions for the intended operating environment.

Soc System On Chip Part Context

This part belongs to the Agilex I series, which targets cost-sensitive applications compared to higher-end Agilex families. It shares architectural similarities with other Agilex SoCs but offers distinct logic densities and package options. The series utilizes Intel's 10nm process technology to deliver performance efficiency for embedded computing and industrial markets.

Soc System On Chip Replacement Considerations

Direct substitutes may include other Agilex I models with similar logic densities such as AGIB027 or AGIB022 series parts, provided pinouts and package dimensions are compatible. Cross-family migration to Agilex 7 F-series requires significant redesign due to architectural differences.