AGIC040R39A2E1VB

Overview

The AGIC040R39A2E1VB is an Agilex I series System on Chip (SoC) integrating a 4.047M logic element FPGA fabric with a quad-core ARM Cortex-A53 processor cluster. The processor operates at speeds up to 1.4GHz and includes NEON SIMD and floating-point units. It utilizes a 3948-ball BGA package measuring 56x56 mm. The device supports a junction temperature range of -40°C to 100°C and features integrated peripherals including DMA and WDT.

Feature Summary

• Integrates programmable logic fabric with embedded ARM processing cores for heterogeneous computing
• Supports high-speed connectivity interfaces including Ethernet, USB OTG, and SPI
• Includes CoreSight debug infrastructure within the processor subsystem

Applications

• High-performance industrial automation controllers
• Telecommunications baseband processing units
• Advanced automotive infotainment systems

Procurement Notes

Verify the specific suffix E1VB against official Altera documentation to confirm pinout and electrical characteristics. Confirm availability through authorized distributors as lead times vary. Ensure compatibility with required configuration devices and verify thermal management requirements for the BGA package before procurement.

Selection Notes

Select this model when both substantial FPGA logic resources and multi-core ARM processing are required in a single component. Compare logic density and processor speed against other Agilex I variants. Verify that the 3948-ball package fits the target PCB footprint and that the operating temperature range meets environmental specifications.

Part Context

This component belongs to the Agilex I family, designed for mid-range applications requiring balanced performance and power efficiency. It sits below higher-density Agilex 7 models while offering more processing capability than pure FPGA counterparts. The series targets cost-sensitive high-performance markets.

Replacement Considerations

Direct substitutes include other Agilex I SoCs with similar logic counts. Verify pin-to-pin compatibility if replacing within the same package type. Consult official cross-reference guides for functional equivalents with adjusted memory or interface configurations.