AGIC040R39A2E3E

Overview

The Altera AGIC040R39A2E3E is an Agilex 7 I-Series System on Chip FPGA. It integrates a four-core ARM Cortex-A53 processor with the Agilex 7 programmable fabric, which provides approximately 4.047 million logic elements. The device operates at a maximum processor frequency of 1.4 GHz and utilizes a 3948-ball BGA package measuring 56x56 mm. It supports high-speed transceiver interfaces and includes embedded memory resources for system control and data buffering within the SoC architecture.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point units
• Combines high-density Agilex 7 FPGA fabric with hard processor system capabilities
• Supports diverse connectivity including Ethernet, USB OTG, and SPI interfaces

Applications

• High-performance industrial automation controllers
• Telecommunications infrastructure equipment
• Advanced automotive infotainment systems

Procurement Notes

Verify the specific suffix E3E against official datasheets to confirm temperature grade and package variant. Confirm availability through authorized distributors as supply status varies. Ensure design files match the exact part number revision to avoid compatibility issues during implementation.

Selection Notes

Select this model when both substantial FPGA logic capacity and embedded processing are required. Compare logic element counts against alternative Agilex variants to ensure sufficient resource headroom. Verify that the BGA package dimensions fit the target board layout constraints.

Part Context

This component belongs to the Agilex 7 I-Series family, designed for cost-sensitive applications requiring significant programmable logic alongside embedded processing. It shares architectural similarities with other Agilex devices but offers specific integration levels tailored for mid-range performance requirements.

Replacement Considerations

Direct substitutes include other Agilex 7 I-Series variants such as AGIA040R39A2I1V. Verify pinout compatibility and thermal characteristics before swapping components in existing designs.