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The AGID019R18A2E2V is an Agilex I Series System on Chip (SoC) integrating a Field Programmable Gate Array with a quad-core ARM Cortex-A53 processor. It features 1.9 million logic elements and operates at a maximum frequency of 1.4 GHz. The device includes 256 KB of RAM and provides 480 input/output pins. It utilizes a 1805-BGA package measuring 42.5 x 42.5 mm. The component supports industrial temperature ranges from -40°C to 100°C TJ and includes peripherals such as DMA and WDT.
Verify the specific suffix codes against official Altera documentation to confirm temperature range and package variations. Confirm lead times directly with authorized distributors as supply chain conditions fluctuate. Ensure compatibility with existing board designs regarding the 1805-BGA footprint and power delivery requirements before finalizing procurement orders.
Select this model when both high-performance ARM processing and significant FPGA logic resources are required in a single package. Compare against the AGIB series if commercial temperature ranges suffice, or consider the AGIF series for higher performance tiers. Validate that the 1.9M logic element count meets design complexity needs without excessive over-provisioning.
This component belongs to the Intel Agilex family, representing a convergence of FPGA flexibility and embedded processor efficiency. The Agilex I series targets mid-range applications balancing cost and performance. It succeeds previous generations by offering improved power efficiency and enhanced security features integrated into the silicon architecture.
Direct pin-to-pin replacements within the same package are limited. Evaluate the AGIB019R18A2E2VB for commercial temperature variants or the AGID019R18A2I2VB for different speed grades. Verify electrical characteristics and software compatibility when migrating between Agilex I sub-series.