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The AGID019R18A2I3E is an Agilex I SoC FPGA featuring a quad-core ARM Cortex-A53 processor with CoreSight, NEON, and floating-point units. It integrates 1.9 million logic elements and operates at speeds up to 1.4 GHz. The device includes 256 KB of RAM and supports 480 I/Os. It utilizes a 1805-BBGA package with bare pads, measuring 42.5 x 42.5 mm. Operating temperature ranges from -40°C to 100°C TJ. Connectivity options include EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
Verify the specific suffix 'E3' against official Altera documentation to confirm exact speed grade and package variant. Confirm moisture sensitivity level (MSL) requirements prior to PCB assembly. Ensure compatibility with Quartus Prime software versions supporting the Agilex I family. Check for any recent Product Change Notifications (PCN) affecting marking or labeling.
Select this model when a balance of moderate logic density (1.9M LEs) and robust ARM processing is required. Compare with AGIB variants if industrial temperature range (-40°C to 100°C) is mandatory, as some Agilex I parts differ in thermal specs. Verify pinout compatibility with existing designs referencing the 1805-BBGA footprint.
This component belongs to the Agilex I series, designed for mid-range performance applications. It sits between lower-density Cyclone devices and higher-end Agilex 7 families. The Agilex I architecture emphasizes power efficiency and integrated hard processor systems for cost-sensitive embedded solutions.
Publicly confirmed direct substitute part numbers are not available in the provided source material. Consult Altera's migration guides for Agilex I family members with similar logic counts and package types.