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The AGID023R18A1I1VB is an Agilex I Series System on Chip (SoC) FPGA manufactured by Altera. It integrates a four-core ARM Cortex-A53 MPCore processor with CoreSight technology, ARM NEON, and floating-point units alongside 2.3 million logic elements. The device operates at a speed of 1.4GHz and includes 256KB of RAM. It features 480 I/Os and supports interfaces including EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The component is housed in a 1805-BBGA package with dimensions of 42.5x42.5 mm and bare pads. It has a moisture sensitivity rating and operates within a junction temperature range of 0°C to 100°C.
Verify the specific suffix 'I1' against official Intel/Altera documentation to confirm the exact grade and revision level. Ensure compatibility with the 1805-BBGA footprint during PCB layout. Confirm moisture sensitivity handling requirements prior to assembly. Cross-reference the part number with current datasheets to validate availability status and any recent design changes or notices issued by the manufacturer.
Select this model when a balance of moderate logic capacity (2.3M elements) and robust ARM processing is required. The 1805-BGA package suits designs needing 480 I/Os within a compact form factor. Consider the 0-100°C operating range for standard commercial environments. Evaluate if the integrated memory size meets system constraints before choosing higher-capacity variants.
This component belongs to the Agilex I series, designed for cost-sensitive yet high-performance applications. It sits below the full Agilex 7 F-series in terms of raw performance but offers significant integration through its SoC architecture. The Agilex I line targets markets demanding efficient power consumption and reduced board space compared to larger FPGA families.
Direct substitutes include other Agilex I parts with similar logic counts, such as AGIB023R18A1E1VB or AGIB023R18A1E2VB. Verify pinout compatibility and electrical characteristics before substitution. Different suffixes may indicate variations in temperature range or packaging that require design adjustments.