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The AGID023R18A2E1V is an Agilex I SoC FPGA featuring a quad-core ARM Cortex-A53 processor and 2.3 million logic elements. It utilizes a 1805-ball BGA package with dimensions of 42.5x42.5 mm. The device supports a maximum processor speed of 1.4 GHz and includes 256 KB of RAM. It offers 480 I/Os and operates within a junction temperature range of 0°C to 100°C.
Verify the specific suffix 'A2' against official Altera documentation to confirm silicon revision and manufacturing lot details. Confirm moisture sensitivity level (MSL) requirements and pre-baking procedures before PCB assembly. Ensure the IBGA-1805 package thermal characteristics match the system design constraints.
Select this model when a balance of moderate logic density (2.3M LEs) and robust ARM processing is required. Compare against the AGIB variant if different pinout or feature sets are needed. Verify that the 1805-BGA footprint fits the target board layout and that the 0-100°C operating range meets environmental specifications.
This component belongs to the Agilex I family, specifically the AGI023 series. It serves as a System-on-Chip solution combining FPGA fabric with a hard processor system. The Agilex I series targets cost-sensitive applications requiring efficient power consumption and moderate performance levels compared to higher-tier Agilex families.
Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Altera migration guides for potential cross-family alternatives.