AGID023R18A2E1V

AGID023R18A2E1V

$29,378.69
  • Description:IC FPGA AGILEX-I 1805FBGA
  • Series:Agilex I

SKU:276962b6e634 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-I 1805FBGA
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:-
  • Supplier Device Package:-

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AGID023R18A2E1V

Overview

The AGID023R18A2E1V is an Agilex I SoC FPGA featuring a quad-core ARM Cortex-A53 processor and 2.3 million logic elements. It utilizes a 1805-ball BGA package with dimensions of 42.5x42.5 mm. The device supports a maximum processor speed of 1.4 GHz and includes 256 KB of RAM. It offers 480 I/Os and operates within a junction temperature range of 0°C to 100°C.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology for embedded processing.
  • Provides 2.3 million logic elements for high-density programmable logic applications.
  • Supports multiple connectivity interfaces including Ethernet, USB OTG, SPI, and UART.

Applications

  • High-performance embedded systems requiring combined FPGA and processor capabilities.
  • Industrial automation controllers utilizing ARM Cortex-A53 processing cores.
  • Network infrastructure equipment leveraging integrated Ethernet and high-speed I/O.

Procurement Notes

Verify the specific suffix 'A2' against official Altera documentation to confirm silicon revision and manufacturing lot details. Confirm moisture sensitivity level (MSL) requirements and pre-baking procedures before PCB assembly. Ensure the IBGA-1805 package thermal characteristics match the system design constraints.

Selection Notes

Select this model when a balance of moderate logic density (2.3M LEs) and robust ARM processing is required. Compare against the AGIB variant if different pinout or feature sets are needed. Verify that the 1805-BGA footprint fits the target board layout and that the 0-100°C operating range meets environmental specifications.

Part Context

This component belongs to the Agilex I family, specifically the AGI023 series. It serves as a System-on-Chip solution combining FPGA fabric with a hard processor system. The Agilex I series targets cost-sensitive applications requiring efficient power consumption and moderate performance levels compared to higher-tier Agilex families.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Altera migration guides for potential cross-family alternatives.

AGID023R18A2E1VAGID023R18A2E1V
$29,378.69
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