AGID023R18A2I2VB

AGID023R18A2I2VB

$30,847.42
  • Description:IC FPGA AGILEX-I 1805BGA
  • Series:Agilex I

SKU:74b47810470e Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-I 1805BGA
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1805-BBGA Exposed Pad
  • Supplier Device Package:1805-BGA (42.5x42.5)

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AGID023R18A2I2VB

Overview

The Altera AGID023R18A2I2VB is an Agilex I Series System on Chip (SoC) Field Programmable Gate Array. It integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug support, ARM NEON multimedia extensions, and floating-point units. The device features 1.9 million logic elements and operates at a maximum frequency of 1.4 GHz. It includes 256 KB of embedded RAM and provides 480 input/output pins. The component is housed in a 1805-BBGA package with bare pads, measuring 42.5 x 42.5 mm. It supports an operating junction temperature range from -40°C to 100°C.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point capabilities for embedded control tasks.
  • Provides 1.9 million logic elements for complex programmable logic applications within the Agilex I family.
  • Supports diverse connectivity interfaces including Ethernet, USB OTG, SPI, UART, and MMC/SD/SDIO.

Applications

  • Industrial automation controllers requiring integrated processing and logic
  • Telecommunications infrastructure equipment
  • Embedded systems needing real-time control and data acceleration

Procurement Notes

Verify the specific suffix codes against official datasheets to ensure correct speed grade and package variant. Confirm that the 1805-BBGA bare pad package requirements align with your board assembly capabilities. Check for any recent Product Change Notifications regarding marking or labeling updates before finalizing orders.

Selection Notes

Select this model when a balance of moderate logic density and embedded processing is required. Compare the 1.9M LE count against project complexity to avoid over-specification. Ensure the 480 I/O count meets interface requirements. Consider the 1.4 GHz performance limit for timing closure feasibility in your design constraints.

Part Context

This component belongs to the Agilex I series, positioned as a mid-range solution within Intel's FPGA portfolio. It shares architectural similarities with other Agilex devices but offers distinct logic density and package options. The Agilex I series targets cost-optimized designs without sacrificing significant performance or feature sets found in higher-tier families.

Replacement Considerations

Direct substitutes within the same family include AGID019R18A2I2VB, which offers lower logic density but identical packaging and pinout compatibility. Verify functional equivalence carefully, as logic element counts differ significantly between these variants.

AGID023R18A2I2VBAGID023R18A2I2VB
$30,847.42
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