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The Altera AGID023R31B2E2VB is an Agilex 7 I-Series System on Chip (SoC) FPGA. It integrates a hard processor system with a quad-core ARM Cortex-A53 MPCore and a programmable fabric containing 2.2 million logic elements. The device operates at a maximum frequency of 1.4 GHz and includes 256 KB of embedded RAM. It utilizes a 3184-ball Flip-Chip Ball Grid Array (FCBGA) package with dimensions of 56x45 mm. The component supports a junction temperature range of 0°C to 100°C and features extensive connectivity options including Ethernet, USB OTG, SPI, and UART.
Verify the specific suffix B2E2VB against official datasheets to confirm package type and commercial temperature grade. Ensure compatibility with Agilex 7 development tools and licensing requirements before procurement. Confirm moisture sensitivity level handling procedures are available for the FCBGA package upon receipt.
Select this model when a balance of moderate logic density and integrated ARM processing is required. Compare against the F-Series for higher performance or lower density variants if cost optimization is critical. Verify that the 3184-BGA footprint fits the target PCB layout constraints and thermal management design.
This component belongs to the Agilex 7 I-Series, designed for cost-optimized designs without compromising essential performance. It shares architectural similarities with other Agilex 7 devices but offers specific logic element counts and package configurations tailored for mid-range applications within the broader Altera portfolio.
Direct substitutes include other Agilex 7 I-Series devices with similar logic densities such as AGIB022R31A2E2VB, provided pinout and performance requirements align. Cross-family migration to Agilex 5 may require significant design adaptation.