AGID023R31B2I3E

AGID023R31B2I3E

$32,926.58
  • Description:IC FPGA AGILEX-I 3184FBGA
  • Series:Agilex I

SKU:82b4ad1e9da6 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-I 3184FBGA
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:3184-BFBGA Exposed Pad
  • Supplier Device Package:3184-BGA (56x45)

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AGID023R31B2I3E

Overview

The Altera AGID023R31B2I3E is an Agilex I Series System on Chip (SoC) FPGA featuring a hard processor system with a quad-core ARM Cortex-A53 MPCore. It integrates 2.3 million logic elements within a 3184-ball FBGA package measuring 56x45 mm. The device operates at speeds up to 1.4 GHz and includes 256 KB of RAM. It supports interfaces including Ethernet, USB OTG, SPI, UART, and I2C. The operating junction temperature range is 0°C to 100°C.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with CoreSight debug capabilities
  • Provides 2.3 million logic elements for complex programmable logic applications
  • Supports high-speed connectivity via integrated Ethernet and USB OTG controllers

Applications

  • Industrial automation control systems
  • Telecommunications infrastructure equipment
  • Embedded computing platforms requiring mixed signal processing

Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package dimensions and thermal characteristics. Confirm RoHS compliance status through manufacturer documentation prior to integration. Ensure ESD handling protocols are followed during assembly due to moisture sensitivity classification.

Selection Notes

Select this model when a balance of moderate logic density and embedded processing power is required. Compare against the AGIB series variants if extended temperature ranges or different I/O counts are necessary. Validate pin compatibility with existing board layouts using official IBGA-3184 package drawings.

Part Context

This component belongs to the Agilex I family, designed for cost-optimized designs. It sits below higher-density Agilex F-series devices in terms of logic capacity while maintaining comparable processor core architectures. The R31B designation indicates the specific package type used in this configuration.

Replacement Considerations

Direct substitutes include other Agilex I SoC variants such as AGIB023R31B2E3V or AGIB022R31B3I3E, provided pinouts and logic densities align with design requirements. Verify software IP compatibility across the Agilex I family before swapping part numbers.

AGID023R31B2I3EAGID023R31B2I3E
$32,926.58
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