AGID023R31B2I3V

AGID023R31B2I3V

$28,223.58
  • Description:IC FPGA AGILEX-I 3184FBGA
  • Series:Agilex I

SKU:f4d26dc80b30 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-I 3184FBGA
  • Series:Agilex I
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:3184-BFBGA Exposed Pad
  • Supplier Device Package:3184-BGA (56x45)

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AGID023R31B2I3V

Overview

The Altera AGID023R31B2I3V is an Agilex I Series System on Chip (SoC) FPGA featuring a hard processor system with a quad-core ARM Cortex-A53 MPCore. It integrates 2.3 million logic elements within a 3184-ball IBGA package measuring 56x45 mm. The device operates at speeds up to 1.4 GHz and includes 256 KB of RAM. It supports various interfaces including Ethernet, USB OTG, SPI, and UART. The operating junction temperature range is specified from 0°C to 100°C.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point capabilities for embedded control tasks.
  • Provides 2.3 million logic elements for complex digital logic implementation alongside the processor subsystem.
  • Supports high-speed connectivity through integrated Ethernet, USB OTG, and standard peripheral interfaces.

Applications

  • Industrial automation controllers requiring combined processing and programmable logic.
  • Communication infrastructure equipment utilizing Ethernet and high-speed serial interfaces.
  • Embedded systems needing real-time processing with flexible hardware acceleration.

Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package type, speed grade, and temperature rating. Ensure compatibility with existing board designs regarding pinout and power requirements before ordering.

Selection Notes

Compare this model against other Agilex I variants based on required logic density and I/O count. Confirm that the 3184-ball package fits the mechanical constraints of the target application. Validate thermal management solutions for the specified operating temperature range.

Part Context

This component belongs to the Agilex I family, designed for mid-range performance applications. It bridges the gap between lower-density Agilex 3 devices and higher-performance Agilex 7 models, offering a balance of cost and capability for embedded SoC designs.

Replacement Considerations

Direct substitutes may include other Agilex I series parts with similar logic counts. Verify pin-to-pin compatibility if replacing in existing designs. Consult official migration guides for architectural differences between Agilex generations.

AGID023R31B2I3VAGID023R31B2I3V
$28,223.58
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