SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AGL1000V2-FG144I is a Microchip IGLOO low-power flash FPGA utilizing a 130-nm process. It provides 1,000,000 system gates and 24,576 VersaTiles within an FG144 package offering 97 user I/Os. The device operates on a core voltage of 1.14 V to 1.575 V and supports industrial temperatures from -40°C to +85°C. Key features include Flash*Freeze technology for ultra-low power retention (5 µW), Instant On capability without external boot PROMs, and integrated clock conditioning circuits with PLLs. It includes 144 kbits of dual-port SRAM and 1 kbit of FlashROM.
Verify the specific ordering suffix 'I' confirms the industrial temperature range (-40°C to +85°C) and 'FG144' denotes the Fine Pitch Ball Grid Array package. Confirm RoHS compliance status as indicated by the 'G' suffix if present in the full part number. Ensure export documentation requirements are met for this semiconductor component.
Select this model for designs requiring high logic density (1M gates) in a compact 144-pin footprint. Verify that the 97 available I/Os meet interface requirements. Consider the 1.2V to 1.5V core voltage support for optimal power efficiency. Ensure the application benefits from nonvolatile configuration to remove external boot devices.
This component belongs to the IGLOO family of low-power flash FPGAs. The 'V2' designation indicates a second-generation variant supporting a wider core voltage range compared to earlier versions. It sits within the 1,000,000 gate segment of the portfolio, offering a balance of capacity and pin count suitable for complex embedded logic applications.
Direct pin-compatible replacements within the same package exist within the AGL1000 series, such as the standard AGL1000 or ARM-enabled M1AGL1000 variants. Note that ARM-enabled parts lack AES decryption capabilities. Verify logic resource sufficiency when migrating to lower-density parts like the AGL600.