AGL1000V2-FG256I

Overview

The AGL1000V2-FG256I is a flash-based Field Programmable Gate Array (FPGA) from the IGLOO family, manufactured by Microchip Technology. It features 1,000,000 system gates and 24,576 VersaTiles. The device includes 144 kbits of true dual-port SRAM organized in 32 blocks of 4,608 bits each, along with 1 kbit of FlashROM. It supports up to 177 user I/Os within a 256-pin Fine Pitch Ball Grid Array (FG256) package measuring 17x17 mm. Operating voltage ranges from 1.14 V to 1.575 V, with an industrial temperature range of -40°C to +100°C.

Feature Summary

• Flash*Freeze technology enables ultra-low power consumption while retaining SRAM and register data without external components.
• Nonvolatile flash architecture provides Instant On capability, eliminating the need for external configuration boot PROMs.
• Integrated AES decryption engine and FlashLock security mechanisms protect intellectual property against invasive and noninvasive attacks.
• Supports mixed-voltage I/O operation across multiple banks, accommodating standards such as LVCMOS, LVTTL, and LVDS.

Applications

• Portable electronics requiring low static and dynamic power consumption.
• Secure remote field updates utilizing AES-protected In-System Programming (ISP).
• Systems needing immediate initialization upon power-up without external memory loading.
• Applications susceptible to firm errors from high-energy neutrons requiring radiation immunity.

Procurement Notes

Verify the specific ordering suffix 'I' confirms the industrial temperature grade (-40°C to +100°C junction temperature). Confirm the 'V2' designation indicates support for the 1.2V to 1.5V core voltage range. Ensure the FG256 package footprint matches the target PCB design constraints. Check for RoHS compliance status associated with the specific manufacturing lot.

Selection Notes

Select this model when designs require 1 million system gates and significant embedded memory resources within a compact 256-pin BGA package. Consider the AGL1000V2 variant over other densities if the application demands maximum logic capacity within the IGLOO family. Verify that the required I/O count does not exceed 177 single-ended pins or available differential pairs in the FG256 configuration.

Part Context

This component belongs to the IGLOO Low Power Flash FPGA family, which utilizes a 130-nm seven-layer metal flash process. The AGL1000 represents the highest density logic capacity within the standard IGLOO series, offering pin-compatible packages across the family to facilitate design migration between different gate counts.

Replacement Considerations

The AGL1000V5-FGG256I serves as a potential alternative within the same package family. Verify compatibility regarding the specific core voltage requirements and feature set differences between the V2 and V5 device generations before substitution.