AGL1000V2-FGG256I

Overview

The AGL1000V2-FGG256I is a flash-based Field Programmable Gate Array (FPGA) from the IGLOO family, manufactured by Microchip Technology. It features 1,000,000 system gates and 24,576 VersaTiles. The device includes 144 kbits of true dual-port SRAM and 1 kbit of FlashROM. It operates within a core voltage range of 1.14 V to 1.575 V and supports up to 177 user I/Os in a 256-pin Fine Pitch Ball Grid Array (FGG256) package. The component supports industrial temperature ranges and incorporates Flash*Freeze technology for ultra-low power consumption.

Feature Summary

• Flash*Freeze technology enables rapid entry into an ultra-low power mode while retaining SRAM and register data without external components.
• Nonvolatile flash architecture provides Instant On capability, eliminating the need for external boot PROMs or configuration memory.
• Integrated security features include FlashLock protection and AES-128 decryption support for secure in-system programming.
• Advanced I/O structure supports mixed-voltage operation across multiple banks with programmable slew rates and drive strengths.

Applications

• Portable electronics requiring low static and dynamic power consumption
• Systems needing instant-on functionality and simplified initialization
• Secure remote field updates and intellectual property protection applications

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm temperature grade and packaging compliance. Ensure that the selected variant matches the required junction temperature range for the intended application environment. Cross-reference the part number with official distributor catalogs to confirm availability and lead times prior to procurement planning.

Selection Notes

Select this device when high logic density combined with nonvolatile configuration is required. Consider the AGL1000V2 series for designs needing flexible I/O voltage levels and robust security features. Evaluate the FG256 package dimensions against board space constraints. Confirm that the available I/O count meets the interface requirements of the target system design.

Part Context

This component belongs to the IGLOO Low Power Flash FPGA family, which utilizes a 130-nm process technology. The AGL1000 variant represents the highest logic density within the standard IGLOO lineup, offering significant scalability for complex digital designs. It serves as a cost-effective alternative to ASICs for medium-volume production runs.

Replacement Considerations

Check for pin-compatible packages within the same IGLOO family, such as FG144 or CS281 variants, if different I/O counts are acceptable. Verify electrical characteristics and thermal performance when substituting with other densities in the AGL1000 series.