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The AGL250V2-FG144T is a flash-based Field Programmable Gate Array from the IGLOO V2 family, manufactured by Microsemi. It features 250,000 system gates and 6,144 VersaTiles (D-flip-flops). The device includes 36 kbits of embedded True Dual-Port SRAM organized in 8 blocks of 4,608 bits. It operates with a core voltage range of 1.2 V to 1.5 V and supports up to 143 user I/Os within an FG144 Fine Pitch Ball Grid Array package measuring 13 mm x 13 mm. The industrial temperature grade covers -40°C to +100°C junction temperature.
Verify the specific suffix 'T' against official Microsemi documentation to confirm its exact definition regarding packaging or testing variations. Ensure the ordering code matches the required industrial temperature range and RoHS compliance status specified in the datasheet.
Select this component when designs require nonvolatile configuration with instant-on capabilities and robust security features. Consider the 250,000 gate capacity and 143 available I/Os for medium-density logic applications. Verify that the FG144 package dimensions fit the target PCB layout constraints.
This part belongs to the IGLOO Low Power Flash FPGA family, which utilizes a 130-nm process. It serves as a cost-effective alternative to ASICs for high-volume consumer and industrial markets, offering reprogrammability and advanced security features integrated directly into the silicon fabric.
Check for pin-compatible packages within the same density class such as CS196 or QN1326 if different form factors are needed. Higher density options like AGL400 or AGL600 may be considered if additional logic resources are required later.
Yes, the AGL250V2 includes an on-chip 128-bit Advanced Encryption Standard (AES) decryption engine for secure in-system programming via JTAG.
The typical power consumption in Flash*Freeze mode for the AGL250 device is 24 µW.
Yes, the AGL250 supports bank-selectable I/O voltages allowing mixed-operation of 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards across up to four banks.