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The AGL250V2-FGG144 is a flash-based Field Programmable Gate Array (FPGA) from the IGLOO family, manufactured by Microchip Technology. It features 250,000 system gates and 6,144 VersaTiles within a 144-pin Fine Pitch Ball Grid Array (FGG144) package. The device operates with a core voltage range of 1.14 V to 1.575 V and supports an industrial temperature range of -40°C to +85°C. It includes 36 kbits of embedded true dual-port SRAM and utilizes Flash*Freeze technology for ultra-low power consumption.
Verify the specific ordering suffix to confirm the package type and temperature grade. Ensure the design tool license matches the required IP implementation. Confirm RoHS compliance status if halogen-free packaging is mandated for the assembly process. Check for any pending product change notifications regarding the manufacturing site or material composition.
Select this model when 250,000 system gates are sufficient for the logic density requirements. Verify that the 144-pin FBGA footprint fits the board layout constraints. Consider the 36 kbit SRAM capacity for data buffering needs. Ensure the design flow supports the 130-nm flash process architecture and utilizes the appropriate clock conditioning circuits.
This component belongs to the IGLOO Low Power Flash FPGA family, which is based on a 130-nm CMOS process. It serves as a nonvolatile programmable logic solution designed to replace ASICs in mid-volume applications. The device offers reprogrammability similar to SRAM FPGAs but retains configuration without external memory.
The M1AGL250 series devices offer architectural compatibility with integrated ARM Cortex-M1 processors. Standard AGL250 variants may differ in temperature grades or package availability. Verify pinout compatibility when migrating between different package options within the same gate count family.