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The AGL400V2-FG144I is a low-power flash FPGA from the IGLOO family, manufactured using a 130-nm process. It provides 400,000 system gates and 9,216 VersaTiles (D-flip-flops). The device operates with a core voltage range of 1.14 V to 1.575 V and supports an industrial temperature range of -40°C to +100°C. It features up to 54 kbits of true dual-port SRAM organized in 12 blocks of 4,608 bits each. The FG144 package offers 144 pins with a 1.0 mm pitch, providing 72 single-ended I/Os or 9 differential I/O pairs.
Verify the specific ordering suffixes against the manufacturer's current datasheet to confirm package type, temperature grade, and RoHS compliance status. Ensure that the selected variant matches the required voltage support and security features for the target application design.
Select this device for designs requiring high logic density within a small footprint and nonvolatile configuration. Consider the available I/O count and RAM resources relative to the design complexity. Verify compatibility with existing development tools and ensure the package dimensions fit the board layout constraints.
This component belongs to the IGLOO Low Power Flash FPGA family, which bridges the gap between CPLDs and ASICs. It offers reprogrammability with the unit cost benefits of standard logic devices, making it suitable for prototyping and low-to-medium volume production runs where flexibility and security are prioritized.
Check for pin-compatible alternatives within the same IGLOO family, such as the AGL250 or AGL600 series, depending on resource requirements. Ensure that any substitute maintains the same package type and temperature rating to avoid PCB redesign.