AGL400V2-FG256

AGL400V2-FG256

$58.43
  • Description:IC FPGA 178 I/O 256FBGA
  • Series:IGLOO

SKU:2ce0dbcc8bae Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 178 I/O 256FBGA
  • Series:IGLOO
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of Logic Elements/Cells:9216
  • Total RAM Bits:55296
  • Number of I/O:178
  • Voltage - Supply:1.14V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 70°C (TA)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:400000

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AGL400V2-FG256

Overview

The AGL400V2-FG256 is a flash-based Field Programmable Gate Array (FPGA) from the IGLOO family, manufactured by Microchip Technology. It features 400,000 system gates and 9,216 VersaTiles within a 256-pin Fine Pitch Ball Grid Array (FG256) package. The device operates with a core voltage range of 1.14V to 1.575V and supports up to 143 user I/Os. It includes 54 kbits of true dual-port SRAM organized into twelve 4,608-bit blocks, along with 1 kbit of FlashROM. The component supports commercial temperature operation from 0°C to +85°C.

Feature Summary

  • Flash*Freeze technology enables ultra-low power consumption while retaining SRAM and register data without external components.
  • Nonvolatile flash architecture provides Instant On capability, eliminating the need for external configuration boot PROMs.
  • Integrated security features include AES-protected in-system programming and FlashLock to protect intellectual property.
  • Advanced I/O structure supports mixed-voltage operation across multiple banks with programmable slew rates and drive strength.

Applications

  • Portable electronics requiring low static and dynamic power consumption
  • Secure remote field updates utilizing AES-protected in-system programming
  • System initialization and critical task execution prior to processor wake-up

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm temperature grade and packaging compliance. Ensure that design files account for the FG256 footprint dimensions and pitch specifications. Confirm availability status directly with authorized distributors as supply conditions may vary. Cross-reference the part number with current revision notices to ensure compatibility with existing manufacturing processes.

Selection Notes

Select this device when a balance of moderate logic density and ultra-low power is required. The 400,000 gate count suits applications needing significant I/O flexibility without high-end performance demands. Consider the FG256 package if board space constraints allow for its 17x17mm footprint. Verify that the 143 available user I/Os meet interface requirements before finalizing the selection.

Part Context

This component belongs to the IGLOO V2 series of low-power flash FPGAs. It shares architectural similarities with the AGL250 and AGL600 models but offers distinct logic capacity and memory resources. The device utilizes a 130-nm process technology and is pin-compatible with other devices in the same package type within the broader IGLOO family.

Replacement Considerations

The AGL400V2-CS196 serves as a pin-compatible alternative within the same package footprint category. Designers migrating from older AGL400 variants should verify software toolchain support for V2-specific features. No direct functional equivalents exist outside the IGLOO family without significant redesign.

AGL400V2-FG256AGL400V2-FG256
$58.43
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