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The AGL400V2-FG484I is a low-power flash FPGA from the Microsemi IGLOO family, featuring 400,000 system gates and 9,216 VersaTiles. It utilizes a 130-nm CMOS process with a core voltage range of 1.14 V to 1.575 V. The device supports up to 194 user I/Os in an FG484 package (23 x 23 mm) and operates within an industrial temperature range of -40°C to +100°C junction temperature. Key specifications include 54 kbits of true dual-port SRAM, six Clock Conditioning Circuits (CCC), and AES-protected In-System Programming.
Verify the specific ordering suffix 'I' confirms the industrial temperature grade (-40°C to +100°C). Confirm the 'Y' suffix indicates inclusion of the Cryptography Research, Inc. patent license. Ensure the FG484 package dimensions match the target PCB footprint requirements.
Select this device when 400,000 system gates are required alongside robust security features. Consider the FG484 package if high pin counts are necessary for complex I/O interfaces. Verify that the 1.2 V to 1.5 V core voltage aligns with the system power architecture.
This component belongs to the IGLOO V2 series, which extends the original IGLOO family with enhanced low-power capabilities and wider voltage support. It shares architectural similarities with the AGL600 and AGL1000 but offers a mid-range gate density suitable for cost-sensitive applications.
The AGL400V2-FG484 is pin-compatible with other devices in the IGLOO family sharing the FG484 package. Check datasheet migration guides for design compliance when moving between densities.
No, ARM Cortex-M1 processor support is available only on M1IGLOO devices. This standard AGL400V2 part does not include an embedded ARM processor.
According to the package I/O table, the FG484 package supports up to 60 differential I/O pairs for the AGL400 device.
During Flash*Freeze mode, I/O states are tristated by default. However, they can be configured to remain in a specific state using weak pull-up or pull-down attributes.