AGL400V2-FGG256I

Overview

The AGL400V2-FGG256I is a flash-based Field Programmable Gate Array from the IGLOO family, manufactured using a 130-nm process. It provides 400,000 system gates and 9,216 VersaTiles within a 256-pin Fine Pitch Ball Grid Array (FGG256) package. The device operates with a core voltage range of 1.14 V to 1.575 V and supports up to 177 user I/Os. It features integrated clock conditioning circuits with an embedded phase-locked loop, 54 kbits of dual-port SRAM, and 1 kbit of FlashROM. The component supports industrial temperature ranges and includes Flash*Freeze technology for ultra-low power retention.

Feature Summary

• Flash*Freeze technology enables rapid entry into and exit from an ultra-low power mode while retaining all SRAM and register data without external components.
• Nonvolatile flash architecture eliminates the need for external configuration boot PROMs, providing instant-on capability and immunity to firm errors caused by high-energy neutrons.
• Integrated security features include FlashLock protection and AES-128 decryption capabilities for secure in-system programming and intellectual property protection.
• Advanced I/O structure supports mixed-voltage operation across multiple banks, accommodating single-ended and differential standards with programmable slew rates.

Applications

• Portable electronics requiring minimal static power consumption and extended battery life
• Secure remote field updates utilizing AES-protected in-system programming
• System initialization tasks and critical logic execution prior to main processor wake-up

Procurement Notes

Verify the specific suffix codes against official Microchip documentation to confirm temperature grade and packaging compliance. Ensure that design files account for the pinout differences between commercial and industrial variants. Confirm RoHS status and environmental declarations directly from the manufacturer's current datasheet revision before finalizing procurement specifications.

Selection Notes

Select this model when designs require nonvolatile reprogrammability combined with low-power standby modes. The AGL400V2 offers sufficient logic density for moderate complexity applications while maintaining a small footprint. Consider the FG256 package dimensions and pitch requirements during PCB layout to ensure compatibility with assembly processes and thermal management strategies.

Part Context

This component belongs to the IGLOO V2 series of low-power flash FPGAs. It serves as a mid-range solution within the family, bridging the gap between lower-density devices like the AGL250 and higher-capacity options such as the AGL600. The V2 designation indicates support for a wider core voltage range compared to earlier generations, enhancing power efficiency flexibility.

Replacement Considerations

Direct pin-compatible replacements within the same package are limited to other AGL400 variants with different temperature grades or speed bins. Migration to higher-density devices like the AGL600 requires verification of routing resource availability and memory allocation constraints within the FPGA fabric.