AGL400V2-FGG256T

Overview

The AGL400V2-FGG256T is a flash-based Field Programmable Gate Array (FPGA) from the Microsemi IGLOO family. It provides 400,000 system gates and 9,216 VersaTiles within an FFG256 package featuring 256 pins. The device supports a core voltage range of 1.2 V to 1.5 V and operates at temperatures from -40°C to +100°C. Key specifications include up to 54 kbits of true dual-port SRAM, six Clock Conditioning Circuits (CCC), and AES-protected In-System Programming.

Feature Summary

• Flash*Freeze technology enables ultra-low power consumption while retaining FPGA content without requiring external components.
• Integrated security features include FlashLock protection and 128-bit Advanced Encryption Standard (AES) decryption for secure in-system programming.
• Instant On capability allows immediate operation upon power-up by storing configuration data directly in on-chip nonvolatile flash cells.
• Advanced I/O structure supports mixed-voltage operation across multiple banks with programmable slew rates and drive strengths.

Applications

• Portable electronics requiring low static power and rapid wake-up times
• Secure remote field updates utilizing AES-protected in-system programming
• Systems needing firm-error immunity against high-energy neutrons

Procurement Notes

Verify the specific ordering suffixes to confirm package type, temperature grade, and lead-free status. Ensure compatibility with existing design flows and tools before procurement. Confirm that the selected variant meets all environmental and electrical requirements for the target application.

Selection Notes

Select this device for designs requiring 400,000 system gates with industrial temperature support. Consider the FFG256 package for its pin count and footprint. Evaluate the need for AES security if remote reprogramming is required. Compare against lower-density models like AGL250 or higher-density models like AGL600 based on logic resource needs.

Part Context

This component belongs to the IGLOO Low Power Flash FPGA family, which utilizes a 130-nm process. The AGL400 model sits between the AGL250 and AGL600 in terms of logic capacity. It shares architectural features such as VersaTiles and Flash*Freeze technology with other devices in the series.

Replacement Considerations

Check for pin-compatible packages within the IGLOO family. Verify if alternative density levels like AGL250 or AGL600 meet functional requirements. Ensure any substitute maintains the same voltage and temperature specifications.