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The AGL600V2-FG256T is a Field Programmable Gate Array from the IGLOO family, featuring 600,000 system gates and 13,824 VersaTiles. It utilizes a 130-nm flash-based CMOS process with a 256-pin Fine Pitch Ball Grid Array (FG256) package measuring 17 x 17 mm. The device supports core voltages between 1.2 V and 1.5 V, achieving up to 250 MHz performance at 1.5 V or 160 MHz at 1.2 V. It includes 108 kbits of True Dual-Port SRAM, 1 kbit of FlashROM, and four I/O banks supporting mixed-voltage standards.
Verify that the ordering suffix 'T' corresponds to tape-and-reel packaging as per Microsemi documentation. Confirm the 'V2' designation indicates the specific voltage range support. Ensure the industrial temperature grade is required for the target environment. Cross-reference the FG256 footprint dimensions during PCB layout.
Select this model for applications requiring 600k gates with a 256-pin BGA footprint. The V2 suffix is critical if the design requires 1.2 V core voltage support alongside 1.5 V. Verify that the 108 kbits of embedded RAM meets data storage requirements. Consider the FG256 package height constraints relative to the enclosure design.
This component belongs to the IGLOO Low Power Flash FPGA family manufactured by Microsemi. It shares architectural features such as VersaTiles and Flash*Freeze with other devices in the series like the AGL600V5. The FG256 package is footprint-compatible with the FG484 variant within the same density class.
The AGL600V5-FG256 is a pin-compatible alternative offering V5 specifications. Designers migrating from older versions should verify voltage compatibility and feature differences in the datasheet before substitution.