AGL600V2-FGG144I

Overview

The Microchip AGL600V2-FGG144I is an IGLOO V2 flash FPGA featuring 600,000 system gates and 13,824 VersaTiles. It operates within a core voltage range of 1.14 V to 1.575 V and supports a maximum user I/O count of 97 in the FG144 package. The device includes 108 kbits of true dual-port SRAM and one integrated PLL within its clock conditioning circuits. Designed for industrial applications, it functions reliably between -40°C and +100°C junction temperature.

Feature Summary

• Flash*Freeze technology enables ultra-low power consumption while retaining design data without external components.
• Instant On capability eliminates the need for external configuration PROMs or boot devices.
• Integrated AES decryption engine provides secure in-system programming and intellectual property protection.
• Advanced I/O structure supports mixed-voltage operation across multiple standards.

Applications

• Portable electronics requiring low static and dynamic power consumption
• Secure remote field updates via encrypted in-system programming
• System initialization tasks executed before main processor wake-up

Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) as defined in the datasheet. Ensure the ordering code matches the exact density and package dimensions required for your PCB layout. Confirm that the non-ARM version meets your logic requirements without the Cortex-M1 processor.

Selection Notes

Select this model when 600,000 system gates are sufficient for the target logic density. The FG144 package offers 97 user I/Os suitable for moderate pin-count designs. Verify that the 1.2V to 1.5V core voltage compatibility aligns with the system power rails. Consider the Flash*Freeze feature if ultra-low standby power is a critical design constraint.

Part Context

This component belongs to the IGLOO V2 family of flash FPGAs from Microchip Technology. It represents a mid-range density solution within the series, offering a balance of logic capacity and power efficiency. The device utilizes a 130-nm process technology and is designed as a drop-in replacement for lower-density CPLDs in many legacy applications.

Replacement Considerations

Direct pin-compatible replacements within the same package include the AGL400 and AGL125 variants, subject to logic resource availability. Higher density options such as the AGL1000 may require board re-layout due to different package footprints. ARM-enabled equivalents like the M1AGL600 offer additional processing capabilities but lack AES decryption support.