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The AGL600V2-FGG256 is a Microchip IGLOOe FPGA featuring 600,000 system gates and 13,824 VersaTiles. It operates within a core voltage range of 1.14 V to 1.575 V and supports an industrial temperature range of -40°C to +100°C. The device provides up to 177 user I/Os in a 256-pin Fine Pitch Ball Grid Array (FGG256) package. It includes 108 kbits of embedded true dual-port SRAM and 1 kbit of FlashROM. Key capabilities include Flash*Freeze technology for ultra-low power retention and Instant On functionality.
Verify the specific ordering suffix to confirm the package type and temperature grade. Ensure compatibility with existing design tools and verify that the selected variant meets the required environmental specifications for the target application environment.
Select this model for designs requiring nonvolatile reprogrammability with high security features. Consider the available I/O count and memory resources against the logic density requirements. Verify that the 256-pin package footprint fits the board layout constraints and thermal management plan.
This part belongs to the IGLOO family of flash FPGAs based on a 130-nm process. It offers a single-chip solution combining FPGA fabric with nonvolatile storage. The family is designed for applications needing low power, small footprint, and instant-on capabilities compared to traditional SRAM-based FPGAs.
Check for pin-compatible packages within the IGLOO family such as FG144 or FG484 if different I/O counts are needed. Verify functional equivalence with M1IGLOO variants if ARM processor integration is required, noting differences in AES support.