SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AGXD500AAXE0CC is a single-core microprocessor based on the AMD Geode GX architecture, operating at a clock speed of 366 MHz. It integrates DDR RAM controllers and hardware graphics acceleration capabilities. The component is housed in a 368-ball BGA package designed for surface-mount technology. It supports an operating temperature range of 0°C to 85°C (Commercial Temperature). This System-on-Chip solution combines processing, memory interface, and display functions into a compact form factor suitable for embedded applications.
Verify the exact package type and pinout configuration against the official datasheet before integration. Confirm that the supplier provides genuine components with traceable origin. Ensure compatibility with existing DDR memory layouts and thermal management solutions for the target enclosure. Check for any specific ordering suffixes that may indicate variant differences.
Select this component when a low-power, integrated solution with graphics output is required for embedded tasks. Consider the 366 MHz performance limit and single-core architecture for workload suitability. Evaluate the 368-BGA footprint constraints during PCB layout. Compare against newer generations if higher processing throughput or extended temperature ranges are necessary for the specific deployment environment.
This part belongs to the AMD Geode series, which was designed for energy-efficient computing and embedded markets. The Geode GX line specifically targeted applications requiring integrated multimedia and connectivity features within a small physical footprint. It represents a legacy architecture often found in established industrial and consumer electronic designs where long-term availability and proven stability are prioritized over cutting-edge performance.
Publicly confirmed substitute part numbers are not available in the provided documentation. Engineers should consult AMD's official obsolescence notices or authorized distributor cross-reference tools for verified alternatives. Direct replacements may require schematic and layout modifications due to potential differences in pin assignments or electrical characteristics.