AGXD500EEXE0BC

AGXD500EEXE0BC

$24.56
  • Description:IC MPU 366MHZ 396TEPBGA
  • Series:-
  • Mfr:Advanced Micro Devices
  • Package:Bulk

SKU:254f14e16ffd Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU 366MHZ 396TEPBGA
  • Series:-
  • Mfr:Advanced Micro Devices
  • Package:Bulk
  • Core Processor:AMD Geode™ GX
  • Number of Cores/Bus Width:1 Core
  • Speed:366MHz
  • Co-Processors/DSP:-
  • RAM Controllers:DDR
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:TFT, VGA
  • Ethernet:-
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:0°C ~ 85°C (TC)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:396-BBGA
  • Supplier Device Package:396-TEPBGA (35x35)
  • Additional Interfaces:PCI

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AGXD500EEXE0BC

Overview

The AGXD500EEXE0BC is an embedded microprocessor belonging to the AMD Geode GX2 family. It operates at a clock frequency of 366 MHz and utilizes a 32-bit x86 instruction set architecture. The device is manufactured using a 0.15-micron process and integrates a dedicated Geode GX2 Graphics/Video Processor. Key architectural features include an integrated floating-point unit, MMX instructions, 3DNow! technology, and Geode Castle instructions. The processor incorporates a single DDR-222 memory channel controller and supports up to 1 GB of physical memory.

Feature Summary

  • Integrates a dedicated graphics and video processing unit for multimedia acceleration
  • Supports specialized instruction sets including MMX, 3DNow!, and Geode Castle
  • Features an integrated floating-point unit within a 32-bit x86 architecture

Applications

  • Embedded computing systems
  • Industrial control applications
  • Point-of-sale terminals

Part Context

This component is part of the AMD Geode GX2 series, designed specifically for low-power embedded environments. It combines general-purpose processing with hardware-accelerated graphics capabilities, targeting applications requiring efficient multimedia performance within constrained power envelopes.

Replacement Considerations

Direct functional replacements are not explicitly documented in available public sources. Selection of alternative processors requires verification of pin compatibility, thermal requirements, and software support for the x86 architecture.

AGXD500EEXE0BCAGXD500EEXE0BC
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