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Product Detailed Parameters
- Description:10/100 BASE T QUAD PORT POE +
- Series:-
- Mfr:Allied Components International
- Package:Tape & Reel (TR)
- Transformer Type:LAN 10/100 Base-T, Power over Ethernet (PoE)
- Inductance:350µH
- ET (Volt-Time):-
- Turns Ratio - Primary:Secondary:1:1 Transmitter, 1:1CT Receiver
- Mounting Type:Surface Mount
- Size / Dimension:1.094" L x 0.480" W (27.80mm x 12.20mm)
- Height - Seated (Max):0.295" (7.50mm)
- Operating Temperature:-40°C ~ 85°C
- Grade:-
- Qualification:-
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Overview
The AHSC-4802I is a surface-mount shielded power inductor manufactured by Allied Components International. It features a composite core construction designed to minimize electromagnetic interference and enhance thermal stability. The component is engineered for high-current applications, offering low DC resistance and consistent inductance values under bias conditions. Its compact form factor supports automated assembly processes in dense PCB layouts.
Feature Summary
- Shielded magnetic structure reduces external EMI
- Composite core material ensures stable performance
- Surface-mount design facilitates automated placement
Applications
- DC-DC converter modules
- Power management integrated circuits (PMICs)
- Portable electronic device power supplies
Procurement Notes
Verify the specific inductance value and current ratings against the official datasheet before procurement. Ensure the ordering suffix matches the required tolerance and packaging format. Confirm that the supplier provides traceable documentation for quality assurance purposes.
Selection Notes
Select this component based on its physical dimensions and electrical characteristics suitable for the target circuit. Evaluate the saturation current and thermal dissipation capabilities relative to the system's power requirements. Ensure compatibility with the manufacturing process and reflow soldering profiles.
Part Context
This inductor belongs to the AHSC series of shielded power inductors from Allied Components International. The series is characterized by its use of composite core materials and surface-mount technology. These components are typically utilized in modern electronics requiring efficient power conversion and minimal spatial footprint.
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