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Product Detailed Parameters
- Description:DIODE SIC 650V 10A PGTO247341
- Series:CoolSiC™
- Mfr:Infineon Technologies
- Package:Tube
- Technology:SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max):650 V
- Current - Average Rectified (Io):10A
- Voltage - Forward (Vf) (Max) @ If:1.7 V @ 10 A
- Speed:No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr):0 ns
- Current - Reverse Leakage @ Vr:60 µA @ 650 V
- Capacitance @ Vr, F:303pF @ 1V, 1MHz
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Supplier Device Package:PG-TO247-3-41
- Operating Temperature - Junction:-40°C ~ 175°C
- Grade:Automotive
- Qualification:AEC-Q100/101
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Overview
The AIDW10S65C5 is a 650V Silicon Carbide Schottky Diode from Infineon's 5th Generation CoolSiC™ Automotive portfolio, housed in a PG-TO247-3-41 package. It features a maximum repetitive reverse voltage (VRRM) of 650 V and a continuous forward current (IF) of 10 A at TC = 134 °C. The typical forward voltage (VF) is 1.5 V at IF = 10 A and Tj = 25 °C. Non-repetitive peak forward current reaches 431 A at TC = 25 °C for 10 µs. Power dissipation is 65 W at TC = 25 °C. Junction temperature ranges from -40 °C to 175 °C.
Feature Summary
- Automotive qualified product validated according to AEC-Q100/101 standards
- Temperature independent switching behavior with no reverse recovery or forward recovery
- High surge current capability and high dv/dt ruggedness
- Pb-free lead plating and RoHS compliant construction
Applications
- Traction inverter systems
- Booster and DCDC converters
- On-board chargers and PFC circuits
Procurement Notes
Verify the specific ordering code SP001725156 against official Infineon documentation to ensure correct component revision. Confirm that the PG-TO247-3-41 package outline matches your PCB footprint requirements. Ensure thermal management design accommodates the specified junction-to-case thermal resistance values under intended operating conditions.
Selection Notes
Select this component when automotive reliability certification is mandatory for 650V applications. The TO247-3 package facilitates through-hole mounting suitable for high-power density designs. Evaluate system efficiency gains derived from low figure of merit compared to silicon alternatives. Verify compatibility with existing gate drive and snubber circuitry designed for SiC devices.
Part Context
This device belongs to the 5th Generation CoolSiC™ Automotive Schottky Diode family. It utilizes thin wafer technology to achieve improved efficiency across all load conditions. The product complements Infineon’s IGBT and CoolMOS™ portfolios within the 650V voltage class, targeting stringent automotive application requirements.
Replacement Considerations
No public confirmed substitute part numbers are documented in the provided datasheet.
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