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Product Detailed Parameters
- Description:IC OPAMP ISOLATION 1 CIRC 8SOIC
- Series:-
- Mfr:Texas Instruments
- Package:Tube
- Amplifier Type:Isolation
- Number of Circuits:1
- Output Type:-
- Slew Rate:-
- Gain Bandwidth Product:1 MHz
- Current - Input Bias:30 µA
- Voltage - Input Offset:50 µV
- Current - Supply:5.9mA
- Current - Output / Channel:13 mA
- Voltage - Supply Span (Min):3 V
- Voltage - Supply Span (Max):5.5 V
- Operating Temperature:-55°C ~ 125°C
- Grade:-
- Qualification:-
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.295", 7.50mm Width)
- Supplier Device Package:8-SOIC
- -3db Bandwidth:-
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Overview
The AMC1301SDWV is a precision isolated amplifier from Texas Instruments designed for high-performance current sensing applications. It features a ±250 mV input range optimized for shunt resistor measurements and provides a fixed gain of 8.2 V/V. The device offers enhanced galvanic isolation rated at 7 kV peak per DIN VDE V 0884-11 and 5 kVrms per UL 1577, ensuring safety compliance in industrial environments. Key electrical specifications include a 3 dB bandwidth of 210 kHz, a gain-bandwidth product of 1 MHz, and a common-mode rejection ratio (CMRR) of 93 dB. Input characteristics feature a maximum offset voltage of 50 µV and an input bias current of 60 µA. It operates on a single supply voltage between 3 V and 5.5 V with a typical quiescent current of 5 mA. The component supports differential outputs and functions reliably within an extended industrial temperature range of -55°C to +125°C.
Feature Summary
- Enhanced galvanic isolation certified to international safety standards including DIN VDE V 0884-11 and UL 1577 for robust noise immunity.
- Precision signal conditioning with low offset voltage and minimal drift, optimized for accurate measurement of low-level shunt voltages.
- Integrated system-level diagnostic capabilities, including common-mode overvoltage detection and high-side power loss detection.
- Wide operating temperature range supporting demanding industrial and automotive thermal conditions.
Applications
- Current sensing in motor drivers and inverters
- Uninterruptible power supply (UPS) systems
- Industrial process control and automation
Procurement Notes
Verify the specific suffix 'SDWV' to confirm the wide-body SOIC-8 package and extended temperature rating (-55°C to +125°C). Ensure compatibility with required isolation certifications for your target market. Confirm moisture sensitivity level handling procedures during assembly. Cross-reference pinout requirements with your PCB layout design. Validate that the fixed gain of 8.2 V/V meets your system's signal scaling needs without additional amplification stages.
Selection Notes
Select this component when high accuracy and strong isolation are critical for protecting sensitive control circuits from high-voltage faults. The wide-body SOIC-8 package facilitates easier manual assembly and improved creepage distances compared to standard packages. Consider the fixed gain of 8.2 V/V against other variants like the AMC1301DWVR if reel packaging is preferred but note the temperature range difference. Evaluate the 210 kHz bandwidth against your switching frequency requirements to ensure adequate signal fidelity.
Part Context
The AMC1301 belongs to Texas Instruments' AMC130x family of precision isolated amplifiers. This series is engineered specifically for current sensing in high-noise environments where traditional amplifiers might fail due to common-mode voltage limitations. The SDWV variant distinguishes itself through its wider body package and extended industrial temperature range, making it suitable for harsher operational conditions than standard commercial-grade counterparts.
Replacement Considerations
The AMC1301DWVR serves as a direct functional substitute within the same family, offering identical electrical performance but differing in packaging format (reel vs. tube) and potentially temperature grade depending on the specific sub-part number verification. Ensure any replacement matches the required isolation voltage ratings and package dimensions for board compatibility.
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