AN17808B

Overview

The AN17808B is a semiconductor component manufactured by Panasonic Semiconductor Singapore, housed in an FP-12S package. The device utilizes a silicon nitride (SiN) chip surface passivation and a copper group fin material. Electrical connections are established via thermalsonic bonding using gold wire, with the chip mounted using silver paste. The lead frame is constructed from an iron group material, featuring an inner surface process of gold plating and an outer surface process of solder dip.

Feature Summary

• Utilizes thermalsonic bonding for interconnects
• Features silicon nitride chip surface passivation
• Constructed with an iron group lead frame

Applications

Procurement Notes

Verify the specific manufacturing revision level against the current Panasonic documentation before procurement. Confirm that the outer lead surface process matches the required application specifications, as historical revisions indicate changes to this parameter. Ensure compatibility with the FP-12S package dimensions provided in the engineering drawings.

Selection Notes

Select this component based on its specific package geometry and internal construction materials. The use of an iron group lead frame and gold-plated inner leads may influence selection for applications requiring specific thermal or electrical characteristics. Verify that the transfer mold epoxy and Au-Si alloy bonding meet the environmental requirements of the target system.

Part Context

This specification document originates from Panasonic Semiconductor Singapore, a division of Panasonic Semiconductor Asia Pte Ltd. The data reflects product specifications maintained by the Semiconductor Company of Matsushita Electric Industrial Co., Ltd. The document serves as the primary reference for the physical and structural attributes of the AN17808B part number.

Replacement Considerations

No public substitute part numbers are identified in the provided source material.