AN17822A

Overview

The AN17822A is a semiconductor device manufactured by Panasonic Semiconductor Singapore, housed in an FP-12S package. The component features a SiN chip surface passivation and utilizes a Fe group lead frame with Ag plating on the inner surface. Outer leads are solder plated using a 98Sn-2Bi alloy. Chip mounting employs Ag paste with thermalsonic bonding using Au wire. The mold material is epoxy, applied via a transfer mold process, with Cu group fins.

Feature Summary

• Utilizes SiN chip surface passivation for structural integrity
• Employs thermalsonic bonding with Au wire for interconnects
• Constructed with epoxy transfer molding for encapsulation

Applications

Procurement Notes

Verify the specific manufacturing revision against the document cover page history, noting changes to outer lead surface processes and chip mounting methods. Confirm compliance with lead-free specifications as amended in March 2005. Ensure the sourcing channel provides documentation matching the FMSC-PSDA-002-01 Rev 1 standard to guarantee alignment with the defined material composition and packaging details.

Selection Notes

Select this component based on its specific FP-12S package dimensions and material constraints. The design requires compatibility with the defined Fe group lead frame and epoxy mold compound. Consider the thermalsonic bonding requirements and the specific 98Sn-2Bi outer lead plating when designing the assembly process. Verify that the application environment supports the defined Cu group fin structure and SiN passivation layer.

Part Context

This specification defines the physical and material construction of the AN17822A semiconductor produced by Panasonic Semiconductor Singapore. It details the FP-12S package geometry, lead frame materials, and assembly techniques including wire bonding and molding. The document serves as the primary reference for the component's structural attributes rather than its electrical performance characteristics.

Replacement Considerations

FAQ