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ANT-868-USP-T is listed in the Antennas RF range at ChipApex. The manufacturer field lists TE Connectivity Linx. Its product description is RF ANT 868MHZ CHIP SOLDER SMD. Review the specifications below when checking this part for your BOM.
The ANT-868-USP-T is a microSplatch™ series chip RF antenna manufactured by TE Connectivity Linx, designed for operation within the UHF frequency group. It supports a center frequency of 868MHz with a bandwidth ranging from 862MHz to 876MHz. The component features a surface mount installation type and utilizes solder termination. Key electrical specifications include a Voltage Standing Wave Ratio (VSWR) of 1.9, a gain of 3.5dBi, and an impedance of 50 Ohms. It is compliant with RoHS standards and holds an MSL rating of 1.
Verify the specific suffix designation against official TE Connectivity Linx documentation to ensure correct variant selection. Confirm that the surface mount footprint matches the target PCB layout dimensions. Check current availability status as supply chain conditions may affect lead times. Ensure environmental compliance requirements align with project specifications.
Select this component for designs requiring low-profile antennas in space-constrained IoT applications. Consider the 3.5dBi gain and 1.9 VSWR for signal integrity requirements. Evaluate the surface mount orientation relative to ground plane constraints. Compare against other microSplatch™ variants if different mounting styles or frequencies are needed.
This part belongs to the microSplatch™ family of chip antennas, which are engineered for high performance in minimal footprints. The ANT-868-USP-T specifically targets sub-GHz ISM bands, providing a reliable solution for wireless sensor networks and industrial IoT deployments where size and efficiency are critical design factors.
Consult official manufacturer cross-reference lists for verified substitutes. Generic equivalents may not match the specific radiation patterns or impedance characteristics of the microSplatch™ design.
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