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ANT-DB1-NSP250-T is listed in the Antennas RF range at ChipApex. The manufacturer field lists TE Connectivity Linx. Its product description is RF ANT 2.4GHZ 5.8GHZ CHIP SOLDER. Review the specifications below when checking this part for your BOM.
Antennas RF specifications for ANT-DB1-NSP250-T
- Description：RF ANT 2.4GHZ 5.8GHZ CHIP SOLDER
- Series：nanoSplatch™
- Mfr：TE Connectivity Linx
- Package：Tape & Reel (TR),Cut Tape (CT)
- RF Family/Standard：Bluetooth, WiFi
- Frequency Group：UHF (2GHz ~ 3GHz), SHF (f > 4GHz)
- Frequency (Center/Band)：2.4GHz, 5.8GHz
- Frequency Range：2.4GHz ~ 2.5GHz, 5.15GHz ~ 5.88GHz
- Antenna Type：Chip
- Number of Bands：2
- VSWR：2, 2.4
- Return Loss：-
- Gain：2.7dBi, 3.7dBi
- Features：-
- Termination：Solder
- Ingress Protection：-
- Grade：-
- Qualification：-
- Mounting Type：Surface Mount
- Height (Max)：0.043" (1.10mm)
- Applications：Bluetooth, Wi-Fi, WLAN, Zigbee™, 802.11, U-NII
- Power - Max：5 W
Antennas RF datasheet and documents for ANT-DB1-NSP250-T
Antennas RF Overview
The ANT-DB1-NSP250-T is a dual-band surface-mount RF antenna manufactured by TE Connectivity Linx. It operates across the 2.4GHz and 5.8GHz frequency ranges, specifically covering 2.4GHz to 2.5GHz and 5.15GHz to 5.88GHz. The component features a nanoSplatch™ series design with solder termination for PCB integration. It provides gains of 2.7dBi at 2.4GHz and 3.7dBi at 5.8GHz, with maximum power handling of 5W. The unit has a maximum height of 0.043 inches (1.10mm) and supports VSWR values of 2 and 2.4 respectively.
Antennas RF Feature Summary
- Dual-band operation supporting both 2.4GHz and 5.8GHz ISM/U-NII bands
- Surface-mount package with solder termination for automated assembly
- NanoSplatch™ technology enabling compact form factor
Antennas RF Applications
- Bluetooth wireless communication devices
- Wi-Fi and WLAN embedded systems
- Zigbee network modules
- U-NII band applications
Antennas RF Procurement Notes
Verify RoHS compliance status and MSL rating prior to procurement. Confirm that the specific tape and reel packaging matches production line requirements. Ensure compatibility with soldering profiles specified in the official datasheet to maintain structural integrity and electrical performance during assembly processes.
Antennas RF Selection Notes
Select this component for applications requiring integrated dual-band functionality within strict spatial constraints. The low profile design suits high-density PCB layouts. Consider the specific gain requirements for each band when designing antenna placement relative to ground planes and housing materials to optimize signal transmission efficiency.
Antennas RF Part Context
This part belongs to the nanoSplatch™ nSP250 family from TE Connectivity Linx. These antennas are engineered for embedded wireless solutions where space is limited. The series offers reliable performance for common industrial and consumer wireless standards without requiring external connectors.
Antennas RF Replacement Considerations
Consult the Antenna Cross Reference Guide provided by TE Connectivity for verified substitute part numbers. Generic replacements may not match the specific gain or VSWR characteristics required for certified wireless protocols.
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