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The AOZ5007QI-01 is a DrMOS integrated circuit from Alpha & Omega Semiconductor, designed for synchronous buck converter applications. It integrates a half-bridge driver and power MOSFETs into a single package. The device supports a load voltage range of up to 25V and delivers a continuous output current of 50A per channel with a peak current capability of 100A. It operates within a junction temperature range of -40°C to 150°C and utilizes a 40-QFN (6x6mm) surface-mount package. The component features PWM interface control and includes built-in protection mechanisms such as under-voltage lockout (UVLO) and shoot-through prevention.
Verify the exact part marking against the manufacturer's datasheet to confirm the AOZ5007QI-01 designation. Ensure the package matches the specified 40-QFN (6x6mm) footprint. Check for RoHS compliance status if required by your assembly process. Confirm that the supplier provides original manufacturer documentation to avoid counterfeit components.
Select this component when designing synchronous buck regulators requiring high current density in a small form factor. The 50A rating suits applications needing significant power delivery from low input voltages. Consider the thermal performance of the 6x6mm QFN package for your PCB layout. Ensure the control loop design accommodates the internal driver characteristics and switching frequencies supported by the DrMOS architecture.
This component belongs to the AOZ50xx series of DrMOS devices from Alpha & Omega Semiconductor. These parts are engineered for high-efficiency power management in computing and communication equipment. The integration of driver and power stages reduces component count and board space compared to discrete solutions. The series targets modern voltage regulator modules where size and efficiency are critical constraints.
Direct replacements may include other 50A DrMOS devices from Alpha & Omega or competitors with compatible pinouts and electrical ratings. Verify that substitute parts match the 40-QFN package dimensions and thermal pad configuration. Ensure equivalent current handling and voltage specifications before implementation.