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The AP2161MPG-13 is a high-side power switch IC from Diodes Incorporated, designed for power distribution applications. It features a single output capable of delivering up to 1 A continuous current with a maximum current limit of 1.5 A. The device operates within a supply voltage range of 2.7 V to 5.5 V and exhibits a maximum on-resistance of 115 mOhms. Key timing specifications include a maximum turn-on time of 50 µs and a maximum idle time of 10 µs. It supports surface-mount installation in an MSOP package and functions reliably across an operating temperature range of -40 °C to +85 °C.
Verify the specific package variant and marking code against the manufacturer's official datasheet before procurement. Confirm that the ordering suffix matches the required tape-and-reel or cut-tape configuration. Ensure compatibility with the target PCB footprint and soldering profile. Cross-reference the RoHS compliance status with current regulatory requirements. Validate the component authenticity through authorized distribution channels to avoid counterfeit risks.
Select this component when a single-channel high-side switch with 1 A capacity is required. Compare the 115 mOhms on-resistance against alternative devices to evaluate power dissipation needs. Consider the 2.7 V to 5.5 V input range for system voltage compatibility. Evaluate the MSOP package size against available board space constraints. Review the thermal performance characteristics relative to the expected ambient operating environment.
This part belongs to the AP2161 series of USB power switches manufactured by Diodes Incorporated. It is categorized as a Power Switch IC for power distribution. The series typically includes variants with different current ratings and channel counts, such as dual-switch models or higher-current single switches. The AP2161MPG-13 specifically denotes the single-output version with the MPG-13 packaging suffix.
AP2161WG-7 offers identical electrical specifications but utilizes a SOT-25 package instead of MSOP. Verify pin-to-pin compatibility and thermal pad requirements if substituting packages. No other direct functional substitutes are confirmed in the provided documentation.