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The AP2191DMPG-13 is a single-channel high-side power switch IC designed for USB 2.0 and hot-swap applications. It operates within a supply voltage range of 2.7V to 5.5V and supports an output current of 1.5A with a fixed current limit of 2.1A. The device features a maximum on-resistance of 115mΩ, a typical rise time of 0.6ms, and a maximum turn-on time of 50µs. It includes thermal limiting, under-voltage lockout, and reverse current blocking. The component functions across an ambient temperature range of -40°C to +85°C and is housed in an MSOP-8 EP package.
Verify the specific suffix 'DMPG-13' against official Diodes Incorporated documentation to confirm the active-high enable configuration and MSOP-8EP exposed pad package variant. Ensure that the ordering information matches the exact electrical specifications required for the target USB 2.0 application. Cross-reference the datasheet revision date to guarantee compliance with current manufacturing standards and RoHS directives before finalizing procurement.
Select this component when a single-channel high-side switch with integrated fault reporting is required for USB 2.0 compliant designs. The active-high enable input distinguishes it from complementary variants like the AP2161D. Consider the 1.5A continuous current rating and 2.1A limit for load requirements. The exposed pad package facilitates thermal dissipation, making it suitable for space-constrained portable devices requiring robust short-circuit protection.
This part belongs to the AP2191 family of single-channel power switches optimized for Universal Serial Bus applications. It complements other variants such as the AP2191MPG-13 and AP2191DSG-13, which share similar electrical characteristics but differ in package types or enable logic. The series provides standardized protection features including thermal shutdown and current limiting for reliable power distribution in modern electronic systems.
The AP2191MPG-13 serves as a functional substitute with identical electrical performance but utilizes a standard MSOP-8 package instead of the exposed pad variant. Verify pin compatibility and thermal management requirements when substituting, as the exposed pad design offers different heat dissipation characteristics. Other family members may require logic inversion adjustments due to differing enable signal polarities.