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AP7335-SNG-7 is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is IC REG LIN POS ADJ U-DFN2020-6. Review the specifications below when checking this part for your BOM.
The AP7335-SNG-7 is a fixed-output low dropout linear regulator manufactured by Diodes Incorporated. It provides a 300mA output current with a typical quiescent current of 35µA and an input voltage range of 2V to 6V. The device features a DFN2020-6 package, a dropout voltage of 150mV at full load, and a power supply rejection ratio of 65dB at 1kHz. Operating ambient temperature ranges from -40°C to 85°C.
Verify that the received component matches the specific SOT25 or DFN2020-6 package configuration required for the target design. Confirm the part number suffix indicates the correct fixed output voltage variant, as the base AP7335 model supports multiple options. Ensure compliance with RoHS standards and check for any recent product change notifications regarding leadframe material updates before finalizing procurement.
Select this regulator when designing battery-powered systems requiring low ground current consumption and high efficiency under light loads. The wide input voltage range accommodates single-cell lithium-ion batteries. Verify that the application load transitions are compatible with the device's fast transient response capabilities and ensure adequate thermal management is provided for the chosen package type.
The AP7335 belongs to a family of low dropout regulators designed for portable electronics. This specific model represents the fixed-output version housed in a DFN2020-6 surface-mount package. It shares core architectural features with adjustable variants and other package options within the same series, focusing on compact footprint and efficient power delivery.
Compatible substitutes include AP7335-XXWG-7 for SOT25 packaging and AP7335-ADJSNG-7 for adjustable output configurations. Cross-reference pinouts and thermal characteristics carefully when transitioning between package types to ensure PCB layout compatibility.
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