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AP7361C-12D-13 is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Diodes Incorporated. Its product description is IC REG LINEAR 1.2V 1A TO252-3. Review the specifications below when checking this part for your BOM.
The AP7361C-12D-13 is a fixed-output linear regulator from Diodes Incorporated, providing a stable 1.2V output at up to 1A load current. It operates within an input voltage range of 2.2V to 6.0V and features a typical dropout voltage of 540mV at full load. The device incorporates an enable pin for power management, achieving a low quiescent current of 60µA. Built-in protections include current limiting at 1.5A, fold-back short circuit protection, and thermal shutdown at 150°C. It is housed in a TO252 (DPAK) surface-mount package.
Verify the specific suffix 'D' corresponds to the TO252 (DPAK) package configuration required for your PCB layout. Confirm that the -13 packaging suffix matches your reel or cut tape requirements. Ensure the 1.2V fixed output aligns with your target rail voltage before finalizing procurement specifications.
Select this component when a fixed 1.2V rail is needed with high current capability up to 1A. The TO252 package offers higher power dissipation compared to smaller packages, suitable for moderate thermal loads. Verify that the input voltage remains within the 2.2V to 6.0V range and that the application benefits from the integrated enable feature for power sequencing.
This part belongs to the AP7361C series, which includes both adjustable and fixed-output variants. The series is designed for low-to-medium power applications requiring high efficiency and low noise. Other members of the family offer different output voltages and package options such as SOT89-5, SO-8EP, and U-DFN3030-8.
Compatible substitutes within the same family include AP7361C-12E-13 (SOT223 package) and AP7361C-12SP-13 (SO-8EP package). These alternatives share identical electrical characteristics but differ in physical footprint and thermal dissipation capabilities due to package variations.
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